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    Slide valve having a housing and a slide element guided within the housing
    1.
    发明授权
    Slide valve having a housing and a slide element guided within the housing 有权
    滑阀具有壳体和在壳体内引导的滑动元件

    公开(公告)号：US09091364B2

    公开(公告)日：2015-07-28

    申请号：US13438597

    申请日：2012-04-03

    申请人： Robert Wieland ,  Rolf Bald

    发明人： Robert Wieland ,  Rolf Bald

    IPC分类号： F16K31/06 ,  F16K11/07 ,  F16H61/02

    CPC分类号： F16K31/0613 ,  F16H2061/0253 ,  F16K11/07

    摘要： A slide valve having a housing and a slide element guided within the housing, at least two hydraulic connections being present on the housing, and at least one of the hydraulic connections communicating hydraulically with at least one control port in a cylindrical guide surface that guides the slide element, the control port extending only over a limited distance in the circumferential direction of the guide surface and cooperating with a control edge of the slide element assigned thereto, the slide element having an essentially cylindrical outer contour and at least one end face, and the slide element being produced by injection molding, and at least one injection point being configured on the end face.

    摘要翻译： 一种滑动阀，其具有壳体和在壳体内引导的滑动元件，至少两个液压连接件存在于壳体上，并且至少一个液压连接件与至少一个控制端口连通，该至少一个控制端口在圆柱形引导表面中引导 滑动元件，所述控制端口仅在所述引导表面的圆周方向上延伸有限的距离并且与所述滑动元件的控制边缘配合，所述滑动元件具有基本上圆柱形的外轮廓和​​至少一个端面，以及 滑动元件通过注射成型制造，并且至少一个注射点构造在端面上。

    Bipolar carrier wafer and mobile bipolar electrostatic wafer arrangement
    3.
    发明授权
    Bipolar carrier wafer and mobile bipolar electrostatic wafer arrangement 失效
    双极载体晶片和移动双极静电晶片布置

    公开(公告)号：US07667945B2

    公开(公告)日：2010-02-23

    申请号：US11912828

    申请日：2006-11-15

    申请人： Robert Wieland ,  Dieter Bollmann

    发明人： Robert Wieland ,  Dieter Bollmann

    IPC分类号： H01L21/673

    CPC分类号： H01L21/6833 ,  H01L31/18 ,  H02N13/00

    摘要： The present invention relates to a bipolar carrier wafer and a mobile, bipolar electrostatic wafer arrangement. Carrier wafers and wafer arrangements of this type can be used in particular in the field of handling technology of semiconductor wafers. The carrier wafer according to the invention serves for mounting a disc-shaped semiconductor component. It has a first surface (2a) as front-side and a second surface (2b) which is situated opposite the first surface (2a) as rear-side. The carrier wafer is configured such that it has a carrier layer (2), an electrically insulating cover layer (3) which surrounds the carrier layer and an electrically conductive layer (4), the latter being disposed on the electrically insulating cover layer and being structured in at least two regions which are separated from each other electrically as electrodes. Electrical contacts are disposed on the rear-side (2b) of the carrier wafer, these electrical contacts being connected to the two electrodes disposed on the front-side (2a). On the electrically conductive layer (4), in addition an electrically insulating cover layer (8) is disposed which covers both the front-side (2a) and the edge of the carrier wafer between the front-side (2a) and the rear-side (2b).

    摘要翻译： 本发明涉及双极载体晶片和移动双极静电晶片装置。 这种类型的载体晶片和晶片布置特别可用于半导体晶片的处理技术领域。 根据本发明的载体晶片用于安装盘形半导体部件。 它具有作为前侧的第一表面（2a）和作为后侧与第一表面（2a）相对的第二表面（2b）。 载体晶片被构造成使得其具有载体层（2），围绕载体层的电绝缘覆盖层（3）和导电层（4），后者设置在电绝缘覆盖层上并且是 构造在至少两个电极彼此分离的区域中，作为电极。 电触头设置在载体晶片的后侧（2b）上，这些电触头与设在前侧（2a）上的两个电极连接。 在导电层（4）上，另外设置有电绝缘覆盖层（8），其覆盖前侧（2a）和前侧（2a）和后侧（2a）之间的载体晶片的前侧（2a）和边缘 侧（2b）。

    Encapsulation compositions
    4.
    发明申请
    Encapsulation compositions 审中-公开
    包封组合物

    公开(公告)号：US20070292361A1

    公开(公告)日：2007-12-20

    申请号：US11811819

    申请日：2007-06-12

    申请人： Teresa Virgallito ,  Robert Wieland ,  Michael Chaney

    发明人： Teresa Virgallito ,  Robert Wieland ,  Michael Chaney

    IPC分类号： A61K8/18 ,  A61K9/50 ,  A61K9/16 ,  C11D17/02

    CPC分类号： A61K8/11 ,  A61K2800/412 ,  A61Q5/02 ,  A61Q5/12 ,  A61Q11/00 ,  A61Q19/00 ,  A61Q19/10

    摘要： Microcapsules having hydrogel walls and a content, the content including a flavour or fragrance active and a solvent therefor, the solvent having a Clog P>5, the solvent being present in such a proportion that the active in solution has a calculated base-ten logarithm of the partition coefficient between the solvent and an continuous aqueous phase containing 1.5% by weight anionic surfactant of at least 1.7. The capsules are useful in providing actives in high surfactant compositions, such as toothpastes and tooth-gels, in which the proportion of active remaining in the capsules on storage is appreciably higher than that achievable by conventional encapsulation techniques.

    摘要翻译： 具有水凝胶壁和含量的微胶囊，其含量包括风味剂或香料活性物质及其溶剂，所述溶剂具有Clog P> 5，所述溶剂的存在比例为溶液中的活性成分具有计算的十对数 的溶剂和含有1.5重量％至少1.7的阴离子表面活性剂的连续水相之间的分配系数。 胶囊可用于在高表面活性剂组合物（例如牙膏和牙胶）中提供活性物质，其中保存在胶囊中的活性物质的比例明显高于通过常规包封技术可获得的活性成分。

    Bipolar Carrier Wafer and Mobile Bipolar Electrostatic Wafer Arrangement
    6.
    发明申请
    Bipolar Carrier Wafer and Mobile Bipolar Electrostatic Wafer Arrangement 失效
    双极载波晶片和移动双极静电晶片布置

    公开(公告)号：US20080237819A1

    公开(公告)日：2008-10-02

    申请号：US11912828

    申请日：2006-11-15

    申请人： Robert Wieland ,  Dieter Bollmann

    发明人： Robert Wieland ,  Dieter Bollmann

    IPC分类号： H01L23/495

    CPC分类号： H01L21/6833 ,  H01L31/18 ,  H02N13/00

    摘要： The present invention relates to a bipolar carrier wafer and a mobile, bipolar electrostatic wafer arrangement. Carrier wafers and wafer arrangements of this type can be used in particular in the field of handling technology of semiconductor wafers. The carrier wafer according to the invention serves for mounting a disc-shaped semiconductor component. It has a first surface (2a) as front-side and a second surface (2b) which is situated opposite the first surface (2a) as rear-side. The carrier wafer is configured such that it has a carrier layer (2), an electrically insulating cover layer (3) which surrounds the carrier layer and an electrically conductive layer (4), the latter being disposed on the electrically insulating cover layer and being structured in at least two regions which are separated from each other electrically as electrodes. Electrical contacts are disposed on the rear-side (2b) of the carrier wafer, these electrical contacts being connected to the two electrodes disposed on the front-side (2a). On the electrically conductive layer (4), in addition an electrically insulating cover layer (8) is disposed which covers both the front-side (2a) and the edge of the carrier wafer between the front-side (2a) and the rear-side (2b).

    摘要翻译： 本发明涉及双极载体晶片和移动双极静电晶片装置。 这种类型的载体晶片和晶片布置特别可用于半导体晶片的处理技术领域。 根据本发明的载体晶片用于安装盘形半导体部件。 它具有作为前侧的第一表面（2a）和作为后侧与第一表面（2a）相对定位的第二表面（2b）。 载体晶片被构造成使得其具有载体层（2），围绕载体层的电绝缘覆盖层（3）和导电层（4），后者设置在电绝缘覆盖层上并且是 构造在至少两个电极彼此分离的区域中，作为电极。 电触点设置在载体晶片的后侧（2b）上，这些电触点连接到设置在前侧（2a）上的两个电极。 在导电层（4）上，另外设置电绝缘覆盖层（8），其覆盖前侧（2a）和前侧（2a）与载体晶片的边缘 后侧（2b）。