Communication tagging
    1.
    发明申请
    Communication tagging 有权
    通讯标签

    公开(公告)号:US20050120108A1

    公开(公告)日:2005-06-02

    申请号:US10724845

    申请日:2003-12-01

    CPC分类号: H04L51/34 G06Q10/107

    摘要: A communication system including a database adapted to store communication tag information; and a database agent. The database agent is adapted to determine if a communication has a task tag. The database agent is adapted to transfer predetermined communication tag information of the task tag of the communication to the database. The database agent is adapted to automatically send a communication based upon information stored in the predetermined communication tag information.

    摘要翻译: 一种通信系统,包括适于存储通信标签信息的数据库; 和数据库代理。 数据库代理适于确定通信是否具有任务标签。 数据库代理适于将通信的任务标签的预定通信标签信息传送到数据库。 数据库代理适于基于存储在预定通信标签信息中的信息来自动发送通信。

    System for identification of defects on circuits or other arrayed products
    2.
    发明授权
    System for identification of defects on circuits or other arrayed products 有权
    用于识别电路或其他阵列产品上的缺陷的系统

    公开(公告)号:US07346470B2

    公开(公告)日:2008-03-18

    申请号:US10459132

    申请日:2003-06-10

    IPC分类号: G06F15/00 G06F17/50

    CPC分类号: H01L22/20

    摘要: A system and method is disclosed for assessing a probability of failure of operation of a semiconductor wafer. The method includes inputting risk factor data into a memory and inputting a plurality of wafers into a semiconductor fabrication manufacturing process. A subset of wafers is selected to obtain a sample population and at least one region of each wafer of the sample population is inspected. Circuit design data associated with each wafer of the sample population is obtained and one or more defects that present an increased risk to the operation of a particular wafer are identified. The identification is a function of the risk factor data, the inspecting step and the circuit design data. A probability of semiconductor wafer failure is calculated.

    摘要翻译: 公开了一种用于评估半导体晶片的操作失败概率的系统和方法。 该方法包括将危险因素数据输入存储器并将多个晶片输入到半导体制造制造过程中。 选择晶片的子集以获得样本群体,并且检查样本群体的每个晶片的至少一个区域。 获得与样品群的每个晶片相关联的电路设计数据,并且识别出对特定晶片的操作具有增加的风险的一个或多个缺陷。 识别是风险因素数据,检查步骤和电路设计数据的函数。 计算半导体晶片故障的概率。