E-beam cured packaging structure, packages, and methods of making
    1.
    发明申请
    E-beam cured packaging structure, packages, and methods of making 审中-公开
    电子束固化包装结构,包装和制造方法

    公开(公告)号:US20070292567A1

    公开(公告)日:2007-12-20

    申请号:US11646808

    申请日:2006-12-27

    摘要: Flexible retort packaging structures, including retort pouches and methods of making both the packaging structures and pouches, wherein an otherwise conventional flexible retort substrate is surface printed, the printed image is optionally overcoated with a protective overcoating material. The printing is accordingly located outwardly of the outer structural layer of the substrate and an overcoating is optionally applied over the printing, such that the printed image is between the optional overcoating and the outer-most structural layer of the substrate. The printed images and optional overcoating are simultaneously cured in an electron beam irradiation process.

    摘要翻译: 柔性蒸煮包装结构,包括蒸馏袋和制造包装结构和袋的方法,其中常规的柔性蒸煮基材被表面印刷,印刷图像任选地用保护性外涂层材料涂覆。 印刷因此位于衬底的外部结构层的外侧,并且任选地在印刷上施加外涂层,使得印刷图像在可选的外涂层和基底的最外层结构层之间。 印刷图像和任选的外涂层在电子束照射过程中同时固化。