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1.发明授权Facilitating cooling of an electronics rack employing water vapor compression system 有权促进使用水蒸气压缩系统的电子机架的冷却公开(公告)号：US08120916B2
公开(公告)日：2012-02-21
申请号：US12561335
申请日：2009-09-17
申请人： Roger R Schmidt , Jyunji Takayoshi , Takeshi Tsukamoto , Masayoshi Funatsu , Minoru Onai , Masaaki Imai , Yoshinori Inoue
发明人： Roger R Schmidt , Jyunji Takayoshi , Takeshi Tsukamoto , Masayoshi Funatsu , Minoru Onai , Masaaki Imai , Yoshinori Inoue
CPC分类号： G06F1/20 , G06F2200/201 , H05K7/20827
摘要： A cooling apparatus and method are provided for facilitating cooling of an electronic apparatus that includes a semiconductor element. The cooling apparatus includes an evaporator containing a coolant and evaporating the coolant under a reduced pressure lower than an ambient pressure to generate a chilled coolant, a condenser regenerating the coolant from a vapor of the coolant and being fluid-communicated with the evaporator through a bypass line, and a circulating pump and a line supplying the chilled coolant to a heat exchange area of the electronic apparatus to conduct a heat exchange with an air flow passing though the semiconductor element at a hot side of the electronic apparatus and returning the coolant after the heat exchange to the condenser.
摘要翻译： 提供了一种用于促进包括半导体元件的电子设备的冷却的冷却装置和方法。 该冷却装置包括一个含有冷却剂的蒸发器，并在低于环境压力的减压下蒸发冷却剂以产生冷却的冷却剂，冷凝器从冷却剂的蒸汽再生冷却剂，并通过旁路与蒸发器流体连通 以及循环泵和将冷却的冷却剂供应到电子设备的热交换区域的线路，以与在电子设备的热侧通过半导体元件的空气流进行热交换，并在冷却剂回流之后返回冷却剂 热交换到冷凝器。
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2.发明申请Facilitating Cooling Of An Electronics Rack Employing Water Vapor Compression System 有权促进使用水蒸汽压缩系统的电子机架的冷却公开(公告)号：US20110063792A1
公开(公告)日：2011-03-17
申请号：US12561335
申请日：2009-09-17
申请人： Roger R. Schmidt , Jyunji Takayoshi , Takeshi Tsukamoto , Masayoshi Funatsu , Minoru Onai , Masaaki Imai , Yoshinori Inoue
发明人： Roger R. Schmidt , Jyunji Takayoshi , Takeshi Tsukamoto , Masayoshi Funatsu , Minoru Onai , Masaaki Imai , Yoshinori Inoue
CPC分类号： G06F1/20 , G06F2200/201 , H05K7/20827
摘要： A cooling apparatus and method are provided for facilitating cooling of an electronic apparatus that includes a semiconductor element. The cooling apparatus includes an evaporator containing a coolant and evaporating the coolant under a reduced pressure lower than an ambient pressure to generate a chilled coolant, a condenser regenerating the coolant from a vapor of the coolant and being fluid-communicated with the evaporator through a bypass line, and a circulating pump and a line supplying the chilled coolant to a heat exchange area of the electronic apparatus to conduct a heat exchange with an air flow passing though the semiconductor element at a hot side of the electronic apparatus and returning the coolant after the heat exchange to the condenser.
摘要翻译： 提供了一种用于促进包括半导体元件的电子设备的冷却的冷却装置和方法。 该冷却装置包括一个含有冷却剂的蒸发器，并在低于环境压力的减压下蒸发冷却剂以产生冷却的冷却剂，冷凝器从冷却剂的蒸汽再生冷却剂，并通过旁路与蒸发器流体连通 以及循环泵和将冷却的冷却剂供应到电子设备的热交换区域的线路，以与在电子设备的热侧通过半导体元件的空气流进行热交换，并在冷却剂回流之后返回冷却剂 热交换到冷凝器。
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