公开(公告)号：US20040256239A1

公开(公告)日：2004-12-23

申请号：US10843984

申请日：2004-05-12

Applicant: Rohm and Haas Electronic Materials, L.L.C.

Inventor： Keith L. Whitlaw ,  Michael P. Toben ,  Andre Egli ,  Jeffrey N. Crosby ,  Craig S. Robinson

IPC: C25D005/02 ,  B05D001/32 ,  B05D005/00

CPC classification number: H05K3/244 ,  C25D5/022 ,  C25D5/10 ,  C25D5/34 ,  H01L2924/0002 ,  H05K3/383 ,  H05K2203/0392 ,  H01L2924/00

Abstract: A method for plating tin or a tin alloy on a substrate such that whiskers are prevented form forming or the number of whickers is reduced in number as well as size.

Abstract translation: 在基板上镀锡或锡合金的方法，使得防止成形形成晶须或数量减少的数量和尺寸。