公开(公告)号：US20240359431A1

公开(公告)日：2024-10-31

申请号：US18766406

申请日：2024-07-08

Applicant: ALANTUM EUROPE GMBH

Inventor： Rene Poss ,  Shadi Saberi ,  Frank Deisel

IPC: B32B15/04 ,  B22F3/11 ,  B22F7/00 ,  B32B15/01 ,  B32B15/20 ,  C22C1/08 ,  C23C14/00 ,  C23C14/04 ,  C23C14/20 ,  C23C14/34 ,  C23C14/58 ,  C25D1/08 ,  C25D3/46 ,  C25D5/00 ,  C25D5/10 ,  C25D5/34

CPC classification number: B32B15/046 ,  B22F3/1137 ,  B22F7/002 ,  B32B15/01 ,  B32B15/018 ,  B32B15/043 ,  B32B15/20 ,  C22C1/08 ,  C23C14/0005 ,  C23C14/046 ,  C23C14/205 ,  C23C14/34 ,  C23C14/5846 ,  C23C14/5873 ,  C25D1/08 ,  C25D3/46 ,  C25D5/10 ,  C25D5/34 ,  C25D5/617

Abstract: A process for producing a metallic foam body, having a substrate made of at least one metal or metal alloy A and a layer of a metal or metal alloy B. The metal or metal alloy A and the metal or metal alloy B are selected from a group consisting of Ni, Cr, Co, Cu, Ag, and any alloy thereof and are different. The process includes providing a porous organic polymer foam. The process also includes depositing at least one first metal or metal alloy A on the porous organic polymer foam. The process further includes burning off the porous organic polymer foam to obtain a metallic foam body substrate. The process yet further includes depositing by electroplating a metallic layer of a metal or metal alloy B at least on a part of the surface of the metallic foam body substrate.

公开(公告)号：US20240240346A1

公开(公告)日：2024-07-18

申请号：US18586085

申请日：2024-02-23

Applicant: Meng Tao ,  Laidong Wang

Inventor： Meng Tao ,  Laidong Wang

IPC: C25D3/66 ,  C25D3/54 ,  C25D5/00 ,  C25D5/10 ,  C25D5/50 ,  C25D7/12 ,  H01L31/0224 ,  H01L31/028 ,  H01L31/068 ,  H01L31/18

CPC classification number: C25D3/665 ,  C25D3/54 ,  C25D5/011 ,  C25D5/10 ,  C25D5/50 ,  C25D7/12 ,  H01L31/022425 ,  H01L31/022458 ,  H01L31/028 ,  H01L31/068 ,  H01L31/0682 ,  H01L31/1804

Abstract: Methods for light-induced electroplating of aluminum are disclosed herein. Exemplary methods may comprise preparing an ionic liquid comprising aluminum chloride (AlCl3) and an organic halide, placing the silicon substrate into the ionic liquid, illuminating the silicon substrate, the illumination passing through the ionic liquid, and depositing aluminum onto the silicon substrate via a light-induced electroplating process, wherein the light-induced electroplating process utilizes an applied current that does not exceed a photo-generated current generated by the illumination.

公开(公告)号：US20240229259A1

公开(公告)日：2024-07-11

申请号：US18561821

申请日：2022-05-19

Applicant: HYDROGENPRO ASA

Inventor： Lars Pleth NIELSEN ,  Richard ESPESETH ,  Per MØLLER ,  Marcus Viktor KRAGH-SCHWARZ ,  Morten Linding FREDERIKSEN

IPC: C25B11/052 ,  C23C8/02 ,  C23C8/08 ,  C23C8/80 ,  C25B1/04 ,  C25B11/031 ,  C25B11/061 ,  C25B11/075 ,  C25D5/10 ,  C25D5/12 ,  C25D5/40 ,  C25D5/48 ,  C25D5/50

CPC classification number: C25B11/052 ,  C23C8/02 ,  C23C8/08 ,  C23C8/80 ,  C25B11/031 ,  C25B11/061 ,  C25B11/075 ,  C25D5/10 ,  C25D5/12 ,  C25D5/40 ,  C25D5/48 ,  C25D5/50 ,  C25B1/04

Abstract: The present invention relates to a method for producing an electrode for alkaline electrolysis based on a composition of sulfides on a Ni foam substrate. In a step. S2) there is performed a sulfiding on the Ni substrate. The step of sulfiding results in the formation of electrocatalytic active nano-sites with Ni—S compounds. It is found that these nano-sites are capable of reducing the so-called overpotential of the electrodes during alkaline water electrolysis, and the production of electrodes may be significantly simplified. In particular, already existing electrolyzer units may benefit from this invention by on-site application of the improved method.

公开(公告)号：US20240224429A1

公开(公告)日：2024-07-04

申请号：US18555031

申请日：2022-04-13

Applicant: Linxens Holding

Inventor： Catheline Ramsamy ,  Nicolas DE GUILLEBON ,  Simon VASSAL

IPC: H05K3/10 ,  C25D5/10 ,  C25D7/00 ,  H05K1/02

CPC classification number: H05K3/107 ,  C25D5/10 ,  C25D7/00 ,  H05K1/028

Abstract: A process for manufacturing a sensor including at least two electrodes, including providing a flexible dielectric substrate having a layer of electrically conductive material on at least one of its sides. The electrodes, conductive connecting tracks and a common current supply track are etched in the layer of electrically conductive material. The process further includes electrodepositing one or more layers on the two electrodes and a step of selectively depositing, electrochemically, on at least one electrode, at least one layer of a material different from the one or more materials already deposited on another electrode.

公开(公告)号：US11987898B2

公开(公告)日：2024-05-21

申请号：US17467838

申请日：2021-09-07

Applicant: RTX CORPORATION

Inventor： Brendan M. Lenz ,  Douglas M. Berczik

IPC: C25D5/10 ,  C25D3/46 ,  C25D3/48 ,  C25D3/50 ,  C25D3/54 ,  C25D5/50 ,  C25D7/00 ,  F01D5/28 ,  F02C3/04

CPC classification number: C25D5/10 ,  C25D3/46 ,  C25D3/48 ,  C25D3/50 ,  C25D3/54 ,  C25D5/50 ,  C25D7/008 ,  F01D5/28 ,  F01D5/288 ,  F02C3/04 ,  F05D2220/32 ,  F05D2300/131 ,  F05D2300/14 ,  F05D2300/15 ,  Y02T50/60

Abstract: An article includes a substrate formed of a molybdenum-based alloy. A barrier layer is disposed on the substrate. The barrier layer is formed of at least one noble metal.

公开(公告)号：US20240061326A1

公开(公告)日：2024-02-22

申请号：US18233180

申请日：2023-08-11

Applicant: ENTEGRIS, INC.

Inventor： Russ V. Raschke ,  Caleb Elwell ,  Brian Wiseman

IPC: G03F1/66 ,  C25D7/00 ,  C25D5/10

CPC classification number: G03F1/66 ,  C25D7/00 ,  C25D5/10

Abstract: Reticle containers include a cover and a baseplate having contact surfaces configured to contact one another when the reticle container is assembled. Relief areas are provided adjacent to at least one of the contact surfaces. The relief areas are such that plating provided on in those relief areas do not contact the other of the cover or the baseplate when the reticle container is assembled. The relief areas can include structures such as beveled regions, depressions, and radiused regions. The relief areas can optionally further serve as a robber during an electroplating process.

公开(公告)号：US20240026559A1

公开(公告)日：2024-01-25

申请号：US17868409

申请日：2022-07-19

Applicant: Integran Technologies Inc.

Inventor： Klaus Tomantschger

IPC: C25D5/10 ,  C25D5/00 ,  C25D15/00 ,  C25D5/16

CPC classification number: C25D5/10 ,  C25D5/617 ,  C25D15/00 ,  C25D5/16

Abstract: Articles including anisotropic electrodeposited layers of fine-grained alloys of Co, Cu, Fe, Ni and/or Zn with minor additions of B, O, P and S that provide high strength, ductility and heat-resistance, are disclosed as well as a process for making the articles. Non-metallic additions of ≤2% are required to significantly increase the maximum temperature at which softening and grain-growth occurs. Electrodeposition conditions in a single plating cell are adjusted and/or modulated to vary at least one property in the deposit direction and/or along the length and/or width of the workpiece once, constantly or repeatedly, to form a graded and/or layered electrodeposit. Variable property metallic material deposits containing, at least in part, a fine-grained microstructure and variable property in the deposit direction and optionally multi-dimensionally, provide superior overall mechanical properties and temperature stability. Various methods and electroplating apparatuses and approaches to practice the invention are also provided.

公开(公告)号：US20240021437A1

公开(公告)日：2024-01-18

申请号：US17863690

申请日：2022-07-13

Applicant: Taiwan Semiconductor Manufacturing Company Limited

Inventor： Kuo-Ching HSU ,  Shyue-Ter LEU

IPC: H01L21/48 ,  H01L23/498 ,  G03F7/00 ,  C25D7/12 ,  C25D5/02 ,  C25D5/10

CPC classification number: H01L21/4857 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49866 ,  G03F7/0035 ,  C25D7/123 ,  C25D5/022 ,  C25D5/10

Abstract: A laser-less packaging substrate fabrication process is provided. A substrate plate including through-plate metal via structures is provided. At least one interconnect-level structure may be formed by performing a unit sequence of processing steps that includes: a metal seed deposition step; a first masking step; a first electroplating step that forms metal lines; a second masking step; a second electroplating step that forms metal via structures; a seed layer etch step; a dielectric material deposition step that forms a dielectric material layer; and a planarization step that removes portions of the dielectric material layer that are more distal from the substrate plate than distal horizontal surfaces of the metal via structures. Laser drilling processing steps are not necessary during manufacture of the packaging substrate.

公开(公告)号：US11851781B2

公开(公告)日：2023-12-26

申请号：US17533015

申请日：2021-11-22

Applicant: MODUMETAL, INC.

Inventor： Christina A. Lomasney

IPC: C25D5/20 ,  C25D7/06 ,  C25D21/10 ,  C25D21/12 ,  C25D5/18 ,  C25D17/00 ,  C25D5/10 ,  B82Y40/00 ,  C25D5/08 ,  C25D17/02 ,  C25D7/04 ,  C25D3/04 ,  C25D3/12 ,  C25D3/20 ,  C25D3/22 ,  C25D3/30 ,  C25D3/34 ,  C25D3/38 ,  C25D3/42 ,  C25D3/44 ,  C25D3/16 ,  C25D3/48 ,  C25D3/54 ,  C25D3/56 ,  C25D5/12 ,  C25D17/06 ,  C23C18/16

CPC classification number: C25D5/20 ,  B82Y40/00 ,  C25D3/04 ,  C25D3/12 ,  C25D3/16 ,  C25D3/20 ,  C25D3/22 ,  C25D3/30 ,  C25D3/34 ,  C25D3/38 ,  C25D3/42 ,  C25D3/44 ,  C25D3/48 ,  C25D3/54 ,  C25D3/56 ,  C25D5/08 ,  C25D5/10 ,  C25D5/12 ,  C25D5/18 ,  C25D7/04 ,  C25D7/0607 ,  C25D7/0614 ,  C25D17/00 ,  C25D17/007 ,  C25D17/02 ,  C25D17/06 ,  C25D21/10 ,  C25D21/12 ,  C23C18/1653 ,  C23C18/1689

Abstract: Described herein are apparatus and methods for the continuous application of nanolaminated materials by electrodeposition.

公开(公告)号：US20230247774A1

公开(公告)日：2023-08-03

申请号：US18125667

申请日：2023-03-23

Applicant: CATLAM, LLC

Inventor： Kenneth S. BAHL ,  Konstantine KARAVAKIS

IPC: H05K3/42 ,  H05K1/11 ,  H05K3/00 ,  H05K3/18 ,  H05K3/46 ,  C25D3/30 ,  C25D3/38 ,  C25D5/02 ,  C25D5/10 ,  C25D5/48 ,  C25D5/34 ,  C25D7/00 ,  C23C18/18 ,  C23C18/38 ,  C23C18/16 ,  C23C28/02 ,  G03F7/00

CPC classification number: H05K3/422 ,  H05K1/115 ,  H05K3/0047 ,  H05K3/184 ,  H05K3/4611 ,  C25D3/30 ,  C25D3/38 ,  C25D5/022 ,  C25D5/10 ,  C25D5/48 ,  C25D5/34 ,  C25D7/00 ,  C23C18/182 ,  C23C18/38 ,  C23C18/1653 ,  C23C18/1689 ,  C23C28/023 ,  G03F7/70425 ,  H05K2201/09509 ,  H05K2203/107 ,  H05K2203/072

Abstract: A circuit board has a dielectric core, a foil top surface, and a thin foil bottom surface with a foil backing of sufficient thickness to absorb heat from a laser drilling operation to prevent the penetration of the thin foil bottom surface during laser drilling. A sequence of steps including a laser drilling step, removing the foil backing step, electroless plating step, patterned resist step, electroplating step, resist strip step, tin plate step, and copper etch step are performed, which provide dot vias of fine linewidth and resolution.