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公开(公告)号：US20230348635A1
公开(公告)日：2023-11-02
申请号：US17731605
申请日：2022-04-28
Applicant: Rohm and Haas Electronic Materials LLC
Inventor： Colin HAYES , Michael K. GALLAGHER , Gregory PROKOPOWICZ
Abstract: There is provided a resin composition from a mixture including: (a) 60-90 weight % of at least one thermosetting resin; and (b) 10-40 weight % of at least one aryl ether resin. The resin composition can be used in electronics applications.
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