公开(公告)号：US20140117503A1

公开(公告)日：2014-05-01

申请号：US13661025

申请日：2012-10-25

Applicant: ROHM AND HAAS ELECTRONIC MATERIALS LLC

Inventor： Mark S. OLIVER ,  Michael K. GALLAGHER

IPC: H01L21/58 ,  H01L29/06

CPC classification number: H01L21/6836 ,  C09D171/02 ,  C09J5/00 ,  C09J11/08 ,  C09J2203/326 ,  C09J2205/302 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2924/00014 ,  H01L2924/014

Abstract: Compositions suitable for temporarily bonding two surfaces, such as a wafer active side and a substrate, are disclosed. Methods of temporarily bonding two surfaces, such as the active side of a wafer and a substrate using the compositions disclosed herein are also provided.

Abstract translation: 公开了适用于暂时粘合两个表面的组合物，例如晶片活性侧和基底。 还提供了使用本文公开的组合物临时粘合两个表面的方法，例如晶片的活性侧和基底。

公开(公告)号：US20160297985A1

公开(公告)日：2016-10-13

申请号：US15055987

申请日：2016-02-29

Applicant: Dow Global Technologies LLC ,  Rohm and Haas Electronic Materials LLC

Inventor： Zhifeng BAI ,  Michael K. GALLAGHER ,  Zidong WANG ,  Christopher J. TUCKER ,  Matthew T. BISHOP ,  Elissei IAGODKINE ,  Mark S. OLIVER

IPC: C09D143/04 ,  C09D7/12 ,  B05D3/00 ,  C09D5/00

CPC classification number: C09D143/04 ,  B05D3/007 ,  B05D3/10 ,  C08G61/02 ,  C08G61/12 ,  C08G2261/3424 ,  C08G2261/344 ,  C08G2261/65 ,  C08L25/10 ,  C08L25/16 ,  C08L27/06 ,  C08L51/04 ,  C08L51/06 ,  C08L51/08 ,  C08L63/00 ,  C08L71/02 ,  C09D5/00 ,  C09D7/65 ,  C09J165/00 ,  H01L21/6835 ,  H01L2221/68318 ,  H05K3/285 ,  C08L65/00

Abstract: Arylcyclobutene polymers having improved toughness are provided. Compositions and methods for coating arylcyclobutene polymers having improved toughness are also provided.

Abstract translation: 提供具有改善的韧性的芳族环烯烃聚合物。 还提供了具有改善的韧性的用于涂覆芳基环丁烯聚合物的组合物和方法。

公开(公告)号：US20160122601A1

公开(公告)日：2016-05-05

申请号：US14992251

申请日：2016-01-11

Applicant: Rohm and Haas Electronic Materials LLC ,  Dow Global Technologies LLC

Inventor： Zhifeng BAI ,  Mark S. OLIVER ,  Michael K. GALLAGHER ,  Christopher J. TUCKER ,  Karen R. BRANTL ,  Elissei IAGODKINE ,  Zidong WANG

IPC: C09J143/04 ,  B32B7/12 ,  H01L21/683 ,  B32B7/06 ,  C09J171/02 ,  C08K5/06

CPC classification number: C09J143/04 ,  B32B7/06 ,  B32B7/12 ,  C08K5/06 ,  C08L71/02 ,  C09J5/06 ,  C09J11/08 ,  C09J125/18 ,  C09J171/02 ,  C09J2471/00 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  Y10T156/10 ,  Y10T428/2848

Abstract: Compositions containing an adhesive material, a release additive and a compatibilizer are suitable for temporarily bonding two surfaces, such as a wafer active side and a substrate. These compositions are useful in the manufacture of electronic devices where a temporary bonding of a component to a substrate is desired.

公开(公告)号：US20150279512A1

公开(公告)日：2015-10-01

申请号：US14636030

申请日：2015-03-02

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Michael K. GALLAGHER ,  Joseph F. LACHOWSKI ,  Gregory P. PROKOPOWICZ ,  Zidong WANG

IPC: H01B3/30 ,  C09D125/02 ,  H01B13/06 ,  C08K5/544

CPC classification number: H01B3/307 ,  C08G2261/3328 ,  C08G2261/3422 ,  C08G2261/3424 ,  C08G2261/65 ,  C09D7/63 ,  C09D125/02 ,  C09D165/00 ,  C09D183/08 ,  H01B13/06

Abstract: Compositions useful for improving the adhesion of coating compositions, such as dielectric film-forming compositions, include a hydrolyzed amino-alkoxysilane having a protected amino moiety. These compositions are useful in methods of improving the adhesion of coating compositions to a substrate, such as an electronic device substrate.

Abstract translation: 可用于改善涂料组合物如电介质成膜组合物的粘附性的组合物包括具有被保护的氨基部分的水解的氨基 - 烷氧基硅烷。 这些组合物可用于改善涂料组合物对基材例如电子器件基材的粘附性的方法。

公开(公告)号：US20170032996A1

公开(公告)日：2017-02-02

申请号：US15291539

申请日：2016-10-12

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Mark S. OLIVER ,  Michael K. GALLAGHER ,  Karen R. BRANTL

IPC: H01L21/683 ,  C09J11/08 ,  C09J143/04

CPC classification number: H01L21/6835 ,  C09J5/00 ,  C09J11/08 ,  C09J143/04 ,  C09J2203/326 ,  C09J2205/302 ,  C09J2423/00 ,  C09J2471/00 ,  H01L21/78 ,  H01L29/06 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381

Abstract: Compositions containing an adhesive material and a release additive are suitable for temporarily bonding two surfaces, such as a wafer active side and a substrate. These compositions are useful in the manufacture of electronic devices where a component, such as an active wafer, is temporarily bonded to a substrate, followed by further processing of the active wafer.

Abstract translation: 含有粘合剂材料和脱模添加剂的组合物适用于临时粘合两个表面，如晶片活性侧和基材。 这些组合物可用于电子器件的制造，其中诸如活性晶片的组分临时结合到衬底上，随后进一步处理活性晶片。

公开(公告)号：US20160122602A1

公开(公告)日：2016-05-05

申请号：US14993123

申请日：2016-01-12

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Mark S. OLIVER ,  Michael K. GALLAGHER ,  Karen R. BRANTL

IPC: C09J143/04 ,  H01L21/683

CPC classification number: H01L21/6835 ,  C09J5/00 ,  C09J11/08 ,  C09J143/04 ,  C09J2203/326 ,  C09J2205/302 ,  C09J2423/00 ,  C09J2471/00 ,  H01L21/78 ,  H01L29/06 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381

Abstract: Compositions containing an adhesive material and a release additive are suitable for temporarily bonding two surfaces, such as a wafer active side and a substrate. These compositions are useful in the manufacture of electronic devices where a component, such as an active wafer, is temporarily bonded to a substrate, followed by further processing of the active wafer.

Abstract translation: 含有粘合剂材料和脱模添加剂的组合物适用于临时粘合两个表面，如晶片活性侧和基材。 这些组合物可用于电子器件的制造，其中诸如活性晶片的组分临时结合到衬底上，随后进一步处理活性晶片。

公开(公告)号：US20150064851A1

公开(公告)日：2015-03-05

申请号：US14017264

申请日：2013-09-03

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Michael K. GALLAGHER ,  Edgardo ANZURES ,  David FLEMING ,  Avin V. DHOBLE ,  Chi Q. TRUONG ,  Anupam CHOUBEY ,  Jeffrey M. CALVERT

IPC: H01L23/29 ,  H01L21/56

CPC classification number: H01L23/295 ,  B32B7/06 ,  B32B7/12 ,  B32B27/08 ,  B32B27/20 ,  B32B27/281 ,  B32B27/308 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  B32B27/38 ,  B32B27/40 ,  B32B2250/24 ,  B32B2264/10 ,  B32B2307/748 ,  B32B2457/00 ,  H01L21/563 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16238 ,  H01L2224/27436 ,  H01L2224/29005 ,  H01L2224/29082 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29298 ,  H01L2224/29387 ,  H01L2224/29388 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83207 ,  H01L2224/9211 ,  H01L2924/12042 ,  Y10T428/31504 ,  Y10T428/31551 ,  Y10T428/31721 ,  Y10T428/31725 ,  Y10T428/31786 ,  H01L2924/207 ,  H01L2924/206 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2224/81 ,  H01L2224/83

Abstract: Underfill structures useful as pre-applied underfill materials comprise a polymer layer having a first polymer region and a second polymer region, wherein the second polymer region comprises inorganic filler. Electronic assemblies comprising a chip or die and a substrate are formed using such multi-layer structured pre-applied underfill.

Abstract translation: 可用作预应用底部填充材料的底部填充结构包括具有第一聚合物区域和第二聚合物区域的聚合物层，其中第二聚合物区域包含无机填料。 使用这种多层结构化的预先施加的底部填充物形成包括芯片或管芯和衬底的电子组件。

公开(公告)号：US20140117504A1

公开(公告)日：2014-05-01

申请号：US14060185

申请日：2013-10-22

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Mark S. OLIVER ,  Michael K. GALLAGHER ,  Karen R. BRANTL

IPC: H01L21/78 ,  H01L29/06

CPC classification number: H01L21/6835 ,  C09J5/00 ,  C09J11/08 ,  C09J143/04 ,  C09J2203/326 ,  C09J2205/302 ,  C09J2423/00 ,  C09J2471/00 ,  H01L21/78 ,  H01L29/06 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381

Abstract: Compositions containing an adhesive material and a release additive are suitable for temporarily bonding two surfaces, such as a wafer active side and a substrate. These compositions are useful in the manufacture of electronic devices where a component, such as an active wafer, is temporarily bonded to a substrate, followed by further processing of the active wafer.

Abstract translation: 含有粘合剂材料和脱模添加剂的组合物适用于临时粘合两个表面，如晶片活性侧和基材。 这些组合物可用于电子器件的制造，其中诸如活性晶片的组分临时结合到衬底上，随后进一步处理活性晶片。

公开(公告)号：US20160040021A1

公开(公告)日：2016-02-11

申请号：US14922393

申请日：2015-10-26

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Zidong WANG ,  Michael K. GALLAGHER ,  Kevin Y. WANG ,  Gregory P. PROKOPOWICZ

IPC: C09D7/12 ,  C09D135/06 ,  C09D143/04 ,  C09D5/00 ,  C09D133/08

CPC classification number: C09D7/63 ,  C07F7/0805 ,  C08F32/00 ,  C08G77/48 ,  C08G77/50 ,  C08G2261/3324 ,  C08G2261/3325 ,  C08G2261/3422 ,  C08G2261/418 ,  C08K5/544 ,  C08L65/00 ,  C09D5/00 ,  C09D133/08 ,  C09D135/06 ,  C09D143/04 ,  C09D165/00 ,  C09D165/02 ,  C09D183/14 ,  H01L21/02118 ,  H01L21/02282 ,  H01L21/02304

Abstract: Compositions useful for improving the adhesion of coating compositions, such as dielectric film-forming compositions, include a hydrolyzed poly(alkoxysilane). These compositions are useful in methods of improving the adhesion of coating compositions to a substrate.

Abstract translation: 用于改善涂料组合物如电介质膜形成组合物的粘附性的组合物包括水解的聚（烷氧基硅烷）。 这些组合物可用于改善涂料组合物与基材的粘附性的方法。

公开(公告)号：US20140120244A1

公开(公告)日：2014-05-01

申请号：US14062677

申请日：2013-10-24

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Zidong WANG ,  Michael K. GALLAGHER ,  Kevin Y. WANG ,  Gregory P. PROKOPOWICZ

IPC: C09D7/12

CPC classification number: C09D7/63 ,  C07F7/0805 ,  C08F32/00 ,  C08G77/48 ,  C08G77/50 ,  C08G2261/3324 ,  C08G2261/3325 ,  C08G2261/3422 ,  C08G2261/418 ,  C08K5/544 ,  C08L65/00 ,  C09D5/00 ,  C09D133/08 ,  C09D135/06 ,  C09D143/04 ,  C09D165/00 ,  C09D165/02 ,  C09D183/14 ,  H01L21/02118 ,  H01L21/02282 ,  H01L21/02304

Abstract: Compositions useful for improving the adhesion of coating compositions, such as dielectric film-forming compositions, include a hydrolyzed poly(alkoxysilane). These compositions are useful in methods of improving the adhesion of coating compositions to a substrate.

Abstract translation: 用于改善涂料组合物如电介质膜形成组合物的粘附性的组合物包括水解的聚（烷氧基硅烷）。 这些组合物可用于改善涂料组合物与基材的粘附性的方法。