摘要:
A card retention mechanism comprises a first and second brackets. The first and second brackets are mountable to a circuit board. Further, the first and second brackets are adapted to retain a circuit card therebetween. The second bracket comprises an exposed region that exposes an electrical contact of the card to be exposed to enable electrical connection of a conductor thereto.
摘要:
A card retention mechanism comprises a first and second brackets. The first and second brackets are mountable to a circuit board. Further, the first and second brackets are adapted to retain a circuit card therebetween. The second bracket comprises an exposed region that exposes an electrical contact of the card to be exposed to enable electrical connection of a conductor thereto.
摘要:
A computer device comprises at least one housing configured with a peripheral opening to enable access to a plurality of components disposed therein, and a cover couplable to the at least one housing over the peripheral opening to cooperatively enclose the plurality of components.
摘要:
A system comprises a circuit board, a pair of electrically-conductive board contacts mounted on the circuit board, and a connector assembly coupled to the board and adapted to receive an electrical component. The connector assembly has a pair of deflectable arms. Each deflectable arm comprises a conductive arm contact. Inserting the electrical component into the connector causes the deflectable arms to be deflected from a resting position and away from said electrical component thereby preventing the board contacts from electrically contacting the arm contacts. When the electrical component is fully seated in the connector, the deflectable arms revert back to the resting positioning thereby causing the arm contacts to electrically contact the board contacts.
摘要:
A system comprises a circuit board, a pair of electrically-conductive board contacts mounted on the circuit board, and a connector assembly coupled to the board and adapted to receive an electrical component. The connector assembly has a pair of deflectable arms. Each deflectable arm comprises a conductive arm contact. Inserting the electrical component into the connector causes the deflectable arms to be deflected from a resting position and away from said electrical component thereby preventing the board contacts from electrically contacting the arm contacts. When the electrical component is fully seated in the connector, the deflectable arms revert back to the resting positioning thereby causing the arm contacts to electrically contact the board contacts.
摘要:
A computer device comprising a display member rotatably coupled to a base member. The display member comprises a vaulted member disposed on a side of the display member opposite a viewing side of a display screen of the display member to stiffen the display member.
摘要:
In certain embodiments, a system comprises a computer housing, a device removably mounted to the computer housing, a removable component coupled to the computer housing under the device, and a power switch coupled to the removable component and responsive to separation of the device from the computer housing.
摘要:
In certain embodiments, a system comprises a computer housing, a device removably mounted to the computer housing, a removable component coupled to the computer housing under the device, and a power switch coupled to the removable component and responsive to separation of the device from the computer housing.
摘要:
A computer microprocessor has a housing portion with a recess formed in a top side wall thereof, and a die portion inset within the recess. Operating heat from the die is removed by heat dissipation apparatus which automatically adapts to variations in the microprocessor bond line thickness and includes a sheet metal EMI shield wall overlying the microprocessor and having a condensing end portion of a thermosyphoning heat pipe secured to its bottom side, with an evaporating end portion of the heat pipe overlying the die recess and being resiliently deflectable toward a phase change thermal pad mounted on the top side of the die and inset into the housing die recess. A laterally Enlarged heat sink section is integrally formed on the evaporating end portion and has a flat bottom side and an arcuate top side. The integral heat sink section is resiliently deflected into the die recess, and has its flat bottom side resiliently pressed against the thermal interface pad, by a spring plate portion of a clamping structure downwardly engaging the arcuate top side of the heat sink section. During operator of the microprocessor, die heat is transferred to the metal shield wall sequentially through the thermal pad and the heat pipe, and then dissipated from the shield wall using fan-generated cooling air flowed along the shield wall.
摘要:
An enclosure for a display for an electronic device is provided. The enclosure comprises a backing portion having a thickness and a surface, at least one side member positioned perpendicular to the surface of the backing portion along a portion of the perimeter of the backing portion, at least one stiffening member, perpendicular to the surface of the backing portion and parallel to at least a portion of a side member, and an opening defined at least in part by the at least one stiffening member, the opening adapted to receive a display panel.