公开(公告)号：US20210252256A1

公开(公告)日：2021-08-19

申请号：US17180217

申请日：2021-02-19

申请人： Ronald J. Berenson ,  Cheuk Yin Paul Leung ,  Nick Rogerson

发明人： Ronald J. Berenson ,  Cheuk Yin Paul Leung ,  Nick Rogerson

IPC分类号： A61M25/02 ,  A61B5/145 ,  A61B5/00 ,  A61B5/257 ,  A61B5/28 ,  A61B5/291 ,  A61F13/00 ,  A61F13/02

摘要： An attachment device used to attach appliances to tissue can incorporate microstructures. A medical device system can comprise a coupling device comprising a base layer, a coupling attached to an air side of the base layer, a microstructure attached to a skin side of the base layer and a patient interaction feature, and an appliance comprising a structure mounted to the coupling to interface with the patient interaction feature. An appliance device comprises a base layer, an appliance structure attached to an air side of the base layer, and a microstructure attached to a skin side of the base layer. An appliance attachment system comprises an appliance, a first component comprising an adhesive backing containing microstructures that are configured to attach to skin, and a second component configured to attach the appliance to the first component.

公开(公告)号：US20230263523A1

公开(公告)日：2023-08-24

申请号：US18111080

申请日：2023-02-17

申请人： Ronald J. Berenson ,  Cheuk Yin Paul Leung

发明人： Ronald J. Berenson ,  Cheuk Yin Paul Leung

IPC分类号： A61B17/072

CPC分类号： A61B17/07207 ,  A61B2017/07214 ,  A61B2017/00526

摘要： A wound closure device in the form of a force modulating deep skin staple. The deep skin staple includes a bridge portion extending along a longitudinal axis to support a first set of staple legs and an opposing second set of staple legs. Each staple leg coupled to the bridge portion via a spring arm. Each staple leg angled towards a middle section of the bridge portion. The staple legs designed to modulate forces with a wound down into the reticular dermis layer when applied to the wound.

公开(公告)号：US20230255630A1

公开(公告)日：2023-08-17

申请号：US18140822

申请日：2023-04-28

申请人： Cheuk Yin Paul Leung ,  Ronald J. Berenson

发明人： Cheuk Yin Paul Leung ,  Ronald J. Berenson

IPC分类号： A61B17/08 ,  A61B17/064

CPC分类号： A61B17/085 ,  A61B17/064 ,  A61B2017/00862

摘要： A wound closure device includes an elastic substrate and a plurality of microstructure arrays coupled to the elastic substrate via an adhesive layer. The device is long enough or wide enough to treat large wounds with the plurality of microstructure arrays distributed along a length of the wound.

公开(公告)号：US20220240935A1

公开(公告)日：2022-08-04

申请号：US17584612

申请日：2022-01-26

申请人： Cheuk Yin Paul Leung ,  Ron Berenson

发明人： Cheuk Yin Paul Leung ,  Ron Berenson

IPC分类号： A61B17/08

摘要： A wound closure device comprises a backing comprising a width configured to extend along at least a portion of a wound from a first end to a second end and a length configured to extend transversely across the wound, an adhesive layer coupled to the backing, a first micro-structure array attached to the backing proximate the first end, the first micro-structure array configured to extend transversely across the wound, a second micro-structure array attached to the backing proximate the second end, the second micro-structure array configured to extend transversely across the wound, and an elongate wound closure space between the first and second micro-structure arrays.