公开(公告)号：US06737117B2

公开(公告)日：2004-05-18

申请号：US10116953

申请日：2002-04-05

申请人： Ronald P. Boisvert ,  Duane R. Bujalski ,  Brian R. Harkness ,  Zhongtao Li ,  Kai Su ,  Bianxiao Zhong

发明人： Ronald P. Boisvert ,  Duane R. Bujalski ,  Brian R. Harkness ,  Zhongtao Li ,  Kai Su ,  Bianxiao Zhong

IPC分类号： B05D304

CPC分类号： C08L83/04 ,  C08G77/12 ,  C08G77/18 ,  C08G77/20 ,  C09D183/04 ,  C08L83/00

摘要： Herein is disclosed a resin solution, comprising (a) about 0.1 solids wt % to about 50 solids wt % of an organosiloxane resin comprising the formula (RSiO3/2)x(R′SiO3/2)y, wherein R is selected from the group consisting of C4-C24 alkyl, C4-C24 alkenyl, C4-C24 alkoxy, C8-C24 alkenoxy, and C4-C24 substituted hydrocarbon; R′ is selected from the group consisting of —H, C1-C4 unsubstituted hydrocarbon, and C1-C4 substituted hydrocarbon; x is from about 5 mole % to about 75 mole %; y is from about 10 mole % to about 95 mole %; and x+y is at least about 40 mole %; and (b) about 50 solids wt % to about 99.9 solids wt % of a resin comprising at least about 90 mole % of the formula HSiO3/2. Also disclosed herein is a method of preparing such a resin solution, as well as a method of preparing a solid coating, comprising (i) coating the resin solution on a surface; (ii) removing the solvent from the resin solution; (iii) removing R groups from the organosiloxane resin; and (iv) curing the resin solution, to form the solid coating. Coatings prepared from the resins disclosed herein have relatively low dielectric constants and also have relatively low SiH content and relatively high modulus.

摘要翻译： 本文公开了一种树脂溶液，其包含（a）约0.1固体wt％至约50固体wt％的包含式（RSiO 3/2）x（R'SiO 3/2）y的有机硅氧烷树脂，其中R选自 由C 4 -C 24烷基，C 4 -C 24烯基，C 4 -C 24烷氧基，C 8 -C 24烯氧基和C 4 -C 24取代的烃组成的基团; R'选自-H，C 1 -C 4未取代的烃和C 1 -C 4取代的烃; x为约5摩尔％至约75摩尔％; y为约10摩尔％至约95摩尔％; x + y为至少约40摩尔％。 和（b）约50固体wt％至约99.9固体wt％的包含至少约90mol％的式HSiO 3/2的树脂。 本文还公开了制备这种树脂溶液的方法，以及制备固体涂层的方法，包括（i）将树脂溶液涂布在表面上; （ii）从树脂溶液中除去溶剂; （iii）从有机硅氧烷树脂中除去R基团; 和（iv）固化树脂溶液以形成固体涂层。 由本文公开的树脂制备的涂料具有相对低的介电常数，并且还具有相对低的SiH含量和相对高的模量。