Interconnection plate having high frequency transmission line through
paths
    1.
    发明授权
    Interconnection plate having high frequency transmission line through paths 失效
    互连板通过路径具有高频传输线

    公开(公告)号:US5302923A

    公开(公告)日:1994-04-12

    申请号:US914952

    申请日:1992-07-16

    摘要: An interconnection plate apparatus provides high frequency signal paths for communication among multiple pc boards and/or high frequency system components. The apparatus includes an interconnection plate which is a conductor having cross-sectional channels at which transmission line structures are formed. The transmission line structure includes a through-plate conductor concentrically surrounded by a through-plate insulator concentrically surrounded by the channel walls. An RF ground ring is positioned between the interconnection plate and a pc board at the transmission line structure. The interconnection plate provides a common ground reference and a common ground path for each board mounted to the interconnection plate. The ground ring structures assure a stable ground connection between the interconnection plate and the pc board ground planes. Different transmission line structures implement different signal transformation functions. The transmission line structure may simply pass the signal. In one embodiment, however, the transmission line structure serves as a low-pass filter.

    摘要翻译: 互连板装置提供用于在多个印刷电路板和/或高频系统部件之间进行通信的高频信号路径。 该装置包括互连板,该互连板是具有形成传输线结构的横截面通道的导体。 传输线结构包括同心地被通道壁围绕的贯穿板绝缘体同心地围绕的贯通板导体。 RF接地环位于互连板和传输线结构的印刷电路板之间。 互连板为安装到互连板的每个板提供公共接地参考和公共接地路径。 接地环结构确保了互连板和PCB板接地层之间的稳定的接地连接。 不同的传输线结构实现不同的信号变换功能。 传输线结构可以简单地传递信号。 然而,在一个实施例中,传输线结构用作低通滤波器。