公开(公告)号：US11224118B2

公开(公告)日：2022-01-11

申请号：US16716827

申请日：2019-12-17

Applicant: SAFT AMERICA

Inventor： James Snyder ,  Jared Good

IPC: H05K1/02 ,  H01M50/50 ,  H01M50/519 ,  H01M50/502 ,  H01M50/505 ,  H01M10/42 ,  H05K1/14

Abstract: A power electronics assembly may include a power component having a thermally and electrically conductive surface; a printed circuit board having a slot; and a bussing element having a protrusion that directly contacts the thermally and electrically conductive surface of the power component via the slot of the printed circuit board, the printed circuit board being disposed between the power component and the bussing element.

公开(公告)号：US10693300B2

公开(公告)日：2020-06-23

申请号：US15856847

申请日：2017-12-28

Applicant: SAFT AMERICA, INC.

Inventor： James Snyder ,  Keith Hensley

IPC: H02J7/00 ,  H02J7/34

Abstract: A method may include activating two or more bypassable battery modules in succession through a current-limiting circuit to precharge an application bus from a power source.

公开(公告)号：US20210185794A1

公开(公告)日：2021-06-17

申请号：US16716827

申请日：2019-12-17

Applicant: SAFT AMERICA

Inventor： James Snyder ,  Jared Good

IPC: H05K1/02 ,  H05K1/14 ,  H05K3/30 ,  H01M2/20

Abstract: A power electronics assembly may include a power component having a thermally and electrically conductive surface; a printed circuit board having a slot; and a bussing element having a protrusion that directly contacts the thermally and electrically conductive surface of the power component via the slot of the printed circuit board, the printed circuit board being disposed between the power component and the bussing element.