METHOD OF FABRICATING DISPLAY DEVICE

    公开(公告)号:US20210320284A1

    公开(公告)日:2021-10-14

    申请号:US17177316

    申请日:2021-02-17

    IPC分类号: H01L51/56 H01L51/52

    摘要: Disclosed is a method of fabricating a display device. The method comprises forming a dielectric layer on an encapsulation layer including a first encapsulation region and a second encapsulation region adjacent to the first encapsulation region, forming a conductive layer on the dielectric layer, forming a first photoresist layer on the conductive layer that overlaps each of the first and second encapsulation regions, forming a second photoresist layer on the first photoresist layer that overlaps the second encapsulation region, and etching the conductive layer based on the first and second photoresist layers. When viewed in a thickness direction of a display panel including the encapsulation layer, at least a portion of the encapsulation layer overlapping the second encapsulation region has a thickness greater than that of the encapsulation layer overlapping the first encapsulation region.

    DISPLAY DEVICE
    6.
    发明申请
    DISPLAY DEVICE 审中-公开

    公开(公告)号:US20180033833A1

    公开(公告)日:2018-02-01

    申请号:US15660827

    申请日:2017-07-26

    摘要: A display device includes a display panel, and a touch sensing unit on the display panel, the touch sensing unit including a first conductive pattern on the display panel, an insulating layer covering the first conductive pattern, and a second conductive pattern on the insulating layer, partially crossing the first conductive pattern, and having a thickness that is greater than a thickness of the first conductive pattern.