公开(公告)号：US20170365503A1

公开(公告)日：2017-12-21

申请号：US15615123

申请日：2017-06-06

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： JEONG DO YANG ,  BYOUNG YONG KIM ,  SEUNG-SOO RYU ,  SANG HYEON SONG ,  JUNG YUN JO ,  SEUNG-HWA HA ,  JEONG HO HWANG

IPC: H01L21/70 ,  H01L27/12 ,  H01L23/532 ,  H01L23/525 ,  H01L23/522 ,  H01L49/02 ,  H01L23/29

CPC classification number: H01L21/707 ,  H01L23/293 ,  H01L23/3157 ,  H01L23/5227 ,  H01L23/5252 ,  H01L23/53238 ,  H01L24/00 ,  H01L27/12 ,  H01L49/02

Abstract: An integrated circuit includes a substrate, a pad electrode disposed on the substrate, and a passivation layer disposed on the pad electrode and including an organic insulating material. The integrated circuit further includes a bump electrode disposed on the passivation layer and connected to the pad electrode through a contact hole. The passivation layer includes an insulating portion having a first thickness and covering an adjacent edge region of the pad electrode and the substrate, and a bump portion having a second thickness, that is greater than the first thickness, and covering a center portion of the pad electrode.