METHOD OF FORMING ENCAPSULATION SUBSTRATE FOR AN ORGANIC LIGHT EMITTING DIODE DISPLAY DEVICE
    1.
    发明申请
    METHOD OF FORMING ENCAPSULATION SUBSTRATE FOR AN ORGANIC LIGHT EMITTING DIODE DISPLAY DEVICE 有权
    用于有机发光二极管显示装置形成封装基板的方法

    公开(公告)号:US20130157396A1

    公开(公告)日:2013-06-20

    申请号:US13767196

    申请日:2013-02-14

    Abstract: An organic light emitting diode (OLED) display device and method of fabrication that includes a substrate having a device region, an outer dam region and an encapsulation region. The encapsulation region includes an inner dam region, an outer dam region and an encapsulation region that correspond to the device region. An encapsulation agent is formed in the encapsulation region of the encapsulation substrate, and filling dams are formed of the same material in the outer dam region and the inner dam region of the encapsulation substrate.

    Abstract translation: 一种有机发光二极管(OLED)显示装置及制造方法,其包括具有器件区域,外部阻挡区域和封装区域的衬底。 封装区域包括对应于器件区域的内坝区域,外坝区域和封装区域。 在封装衬底的封装区域中形成封装剂,并且在封装衬底的外部坝区域和内部阻挡区域中,填充坝由相同的材料形成。

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