公开(公告)号：US20210234122A1

公开(公告)日：2021-07-29

申请号：US16474051

申请日：2018-12-04

Applicant: Samsung Display Co., Ltd.

Inventor： Wonwoo CHOI ,  Wooyong SUNG ,  Sooyoun KIM ,  Junghan SEO ,  Seoyeon LEE ,  Hyoungsub LEE ,  Moonwon CHANG ,  Seunggun CHAE

IPC: H01L51/52 ,  H01L27/32 ,  H01L51/56

Abstract: A display panel including: a substrate including an opening area and a display area surrounding the opening area; a plurality of display elements, each including a pixel electrode, an emission layer, and an opposite electrode, the plurality of display elements being located in the display area; a thin-film encapsulation layer covering the plurality of display elements and including an organic encapsulation layer and an inorganic encapsulation layer; a plurality of grooves located between the opening area and the display area, the plurality of grooves being concave in a depth direction of the substrate and having an undercut structure; and a partition wall located between neighboring grooves among the plurality of grooves.

公开(公告)号：US20210313542A1

公开(公告)日：2021-10-07

申请号：US17351430

申请日：2021-06-18

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Wonwoo CHOI ,  Sooyoun KIM ,  Junghan SEO ,  Wooyong SUNG ,  Seoyeon LEE ,  Hyoungsub LEE ,  Moonwon CHANG ,  Seunggun CHAE

IPC: H01L51/52 ,  H01L27/32

Abstract: A display panel includes a peripheral region adjacent to a display region. The display region includes a hole peripheral region, and a recessed region is overlapped with the hole peripheral region. The display panel also includes a barrier layer with a penetrating opening overlapped with the recessed region, a circuit layer on the barrier layer and including a transistor and insulating layers, and a device layer including an organic light emitting area coupled to the circuit layer. In addition, a module hole is overlapped with the hole peripheral region and penetrates the base substrate, and a first groove is overlapped with the bole peripheral region and corresponds to a portion of the base substrate that is recessed from a top surface of the barrier layer and that encloses the module hole. The insulating layers include inorganic layers and an organic layer having side portions enclosing the module hole.

公开(公告)号：US20210091343A1

公开(公告)日：2021-03-25

申请号：US16909196

申请日：2020-06-23

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Ungsoo LEE ,  Seungwook KWON ,  Kibeom LEE ,  Sooyoun KIM ,  Wooyong SUNG ,  Seoyeon LEE ,  Hyoungsub LEE ,  Moonwon CHANG

IPC: H01L51/52 ,  H01L27/32

Abstract: A display device includes: a substrate including a display area, a first non-display area, a second non-display area, and a bending area; a display element disposed on a surface of the substrate; a resin layer disposed on another surface of the substrate to correspond to the display area, where the resin layer exposes at least a portion of the another surface; an external light-absorbing layer disposed on the another surface exposed by the resin layer; and a first protective layer disposed on the another surface of the substrate to correspond to the first non-display area.

公开(公告)号：US20230380211A1

公开(公告)日：2023-11-23

申请号：US18227346

申请日：2023-07-28

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Wonwoo CHOI ,  Sooyoun KIM ,  Junghan SEO ,  Wooyong SUNG ,  Seoyeon LEE ,  Hyoungsub LEE ,  Moonwon CHANG ,  Seunggun CHAE

IPC: H10K50/844 ,  H10K59/122 ,  H10K59/124

CPC classification number: H10K50/844 ,  H10K59/122 ,  H10K59/124

Abstract: A display panel includes a peripheral region adjacent to a display region. The display region includes a hole peripheral region, and a recessed region is overlapped with the hole peripheral region. The display panel also includes a barrier layer with a penetrating opening overlapped with the recessed region, a circuit layer on the barrier layer and including a transistor and insulating layers, and a device layer including an organic light emitting area coupled to the circuit layer. In addition, a module hole is overlapped with the hole peripheral region and penetrates the base substrate, and a first groove is overlapped with the hole peripheral region and corresponds to a portion of the base substrate that is recessed from a top surface of the barrier layer and that encloses the module hole. The insulating layers include inorganic layers and an organic layer having side portions enclosing the module hole.