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公开(公告)号:US11849622B2
公开(公告)日:2023-12-19
申请号:US17864087
申请日:2022-07-13
发明人: Sungu Kim , Kukbin Lim , Taekwang Kim
CPC分类号: H10K59/40 , G06F1/1616 , G06F1/1643 , G06F3/0446 , H10K50/865 , H10K59/131 , H10K59/38 , G06F2203/04107
摘要: An electronic device including a display panel which displays an image, an input sensor on the display panel, and including a first sensing electrode, a second sensing electrode crossing the first sensing electrode, first and second signal lines connected to ends of the first sensing electrode, and a third signal line connected to one end of the second sensing electrode, and a circuit board electrically connected to the input sensor. The circuit board includes a plurality of insulating layers, a first group signal line disposed on the plurality of insulating layers, and one end of which is electrically connected to the first signal line, a second group signal line disposed on the plurality of insulating layers, and one end of which is electrically connected to the second signal line, and an electromagnetic shielding layer disposed on a portion of the second group signal line.
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公开(公告)号:US11860695B2
公开(公告)日:2024-01-02
申请号:US17894031
申请日:2022-08-23
发明人: Sungyeon Cho , Jin Yong Sim , Taekwang Kim , Kukbin Lim
CPC分类号: G06F1/1652 , G06F1/1643 , H05K1/189 , H05K2201/10128
摘要: An electronic device includes: a display panel including a first region having a pixel therein, a bending region bent with respect to a virtual axis, and a second region with the bending region between the first region and the second region, wherein the first region and the second region are configured to face each other in a bent configuration; a lower plate below the display panel; a flexible circuit board connected to the second region, and including insulating layers with an opening portion in at least part thereof, a ground signal line, and a ground pattern exposed from the insulating layers by the opening portion and connected to the ground signal line; a resin layer on a first surface of the flexible circuit board, and covering the opening portion, the resin layer having a flat surface; and an adhesive layer bonding the resin layer to the lower plate.
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