公开(公告)号：US20230215794A1

公开(公告)日：2023-07-06

申请号：US17743775

申请日：2022-05-13

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Suk Chang HONG ,  Yong Duk LEE ,  Sang Hoon KIM ,  Ki Gon KIM ,  Woo Jeong CHOI ,  Cheol Min SHIN

IPC: H01L23/498 ,  H01L21/48

CPC classification number: H01L23/49838 ,  H01L23/49822 ,  H01L21/4857 ,  H01L24/16

Abstract: A printed circuit board includes: a substrate layer in which a plurality of insulating layers and a plurality of wiring patterns are repeatedly layered, the substrate layer including a conductive via layer disposed in one of the plurality of insulating layers to connect wiring patterns, among the plurality of wiring patterns, disposed on upper and lower surfaces of the one insulating layer, respectively; an uppermost substrate layer including an outermost insulating layer disposed outermost within the substrate layer, and a first wiring pattern disposed in the outermost insulating layer; and a bump pad disposed on a portion of an upper surface of the first wiring pattern and having a length shorter than a length of the first wiring pattern.