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    SUBSTRATE HAVING ELECTRONIC COMPONENT EMBEDDED THEREIN
    3.
    发明申请
    SUBSTRATE HAVING ELECTRONIC COMPONENT EMBEDDED THEREIN 有权

    公开(公告)号：US20210175159A1

    公开(公告)日：2021-06-10

    申请号：US16801906

    申请日：2020-02-26

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Je Sang PARK ,  Chang Yul OH ,  Sang Ho JEONG ,  Yong Duk LEE

    IPC: H01L23/498 ,  H01L21/48

    Abstract: A substrate having an electronic component embedded therein includes a core substrate including first and second wiring layers disposed on different levels and one or more insulating layers disposed between the first and second wiring layers, having a cavity in which a stopper layer is disposed on a bottom surface of the cavity, and including a groove disposed around the stopper layer on the bottom surface; an electronic component disposed on the stopper layer in the cavity; an insulating material covering at least a portion of each of the core substrate and the electronic component and disposed in at least a portion of each of the cavity and the groove; and a third wiring layer disposed on the insulating material. The stopper layer protrudes on the bottom surface.

    ANTENNA SUBSTRATE
    5.
    发明申请
    ANTENNA SUBSTRATE 有权

    公开(公告)号：US20220190479A1

    公开(公告)日：2022-06-16

    申请号：US17208139

    申请日：2021-03-22

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Yang Je LEE ,  Chang Gun OH ,  Hyun Kyung PARK ,  Je Sang PARK ,  Sang Ho JEONG ,  Yong Duk LEE

    IPC: H01Q9/04 ,  H01Q1/22

    Abstract: An antenna substrate includes: a body having a first surface and a second surface opposing each other and a side surface connecting the first surface and the second surface to each other; an antenna portion disposed on the first surface of the body; and a pad portion disposed in the body, exposed to the side surface of the body, and including a plurality of pad layers connected to each other in a first direction from the second surface of the body toward the first surface of the body. At least one of the plurality of pad layers has a greater width in a second direction than in a third direction perpendicular to the second direction when viewed in the first direction.

    SUBSTRATE HAVING ELECTRONIC COMPONENT EMBEDDED THEREIN
    6.
    发明申请
    SUBSTRATE HAVING ELECTRONIC COMPONENT EMBEDDED THEREIN 有权

    公开(公告)号：US20220130766A1

    公开(公告)日：2022-04-28

    申请号：US17569703

    申请日：2022-01-06

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Dae Jung BYUN ,  Chang Hwa PARK ,  Sang Ho JEONG ,  Ki Ho NA ,  Je Sang PARK ,  Yong Duk LEE ,  Jin Won LEE

    IPC: H01L23/538 ,  H01L23/64

    Abstract: A substrate having an electronic component embedded therein includes a core structure including a first insulating body and core wiring layers and having a cavity penetrating through a portion of the first insulating body, an electronic component disposed in the cavity, an insulating material covering at least a portion of each of the core structure and the electronic component and disposed in at least a portion of the cavity, a wiring layer disposed on the insulating material, and a build-up structure disposed on the insulating material and including a second insulating body and a build-up wiring layer. A material of the first insulating body has a coefficient of thermal expansion (CTE) less than a CTE of the second insulating body, and the insulating material has a CTE less than a CTE of a material of the second insulating body.

    CHIP RADIO FREQUENCY PACKAGE AND RADIO FREQUENCY MODULE
    7.
    发明申请
    CHIP RADIO FREQUENCY PACKAGE AND RADIO FREQUENCY MODULE 有权

    公开(公告)号：US20210242595A1

    公开(公告)日：2021-08-05

    申请号：US16891265

    申请日：2020-06-03

    Applicant: Samsung Electro-Mechanics Co., Ltd.

    Inventor： Hak Gu KIM ,  Ho Kyung KANG ,  Seong Jong CHEON ,  Young Sik HUR ,  Jin Seon PARK ,  Yong Duk LEE

    IPC: H01Q9/04 ,  H01Q1/22 ,  H01Q1/38 ,  H01Q5/35

    Abstract: A chip radio frequency package includes a substrate including a first cavity, first and second connection members, a core member, a radio frequency integrated circuit (RFIC) disposed on an upper surface of the substrate, and a first front-end integrated circuit (FEIC) disposed in the first cavity. The core member includes a core insulating layer and a core via that penetrates the core insulating layer. The first connection member has a structure in which a first insulating layer and a first wiring layer are stacked. The second connection member has a second structure in which a second insulating layer and a second wiring layer are stacked. The RFIC inputs or outputs a base signal and a first radio frequency (RF) signal having a frequency higher than a frequency of the base signal, and the first FEIC inputs or outputs the first RF signal and a second RF signal.

    CHIP RADIO FREQUENCY PACKAGE AND RADIO FREQUENCY MODULE
    8.
    发明申请
    CHIP RADIO FREQUENCY PACKAGE AND RADIO FREQUENCY MODULE 有权

    公开(公告)号：US20220037792A1

    公开(公告)日：2022-02-03

    申请号：US17505743

    申请日：2021-10-20

    Applicant: Samsung Electro-Mechanics Co., Ltd.

    Inventor： Hak Gu KIM ,  Ho Kyung KANG ,  Seong Jong CHEON ,  Young Sik HUR ,  Jin Seon PARK ,  Yong Duk LEE

    IPC: H01Q9/04 ,  H01Q5/35 ,  H01Q1/38 ,  H01Q1/22

    Abstract: A chip radio frequency package includes a substrate including a first cavity, first and second connection members, a core member, a radio frequency integrated circuit (RFIC) disposed on an upper surface of the substrate, and a first front-end integrated circuit (FEIC) disposed in the first cavity. The core member includes a core insulating layer and a core via that penetrates the core insulating layer. The first connection member has a structure in which a first insulating layer and a first wiring layer are stacked. The second connection member has a second structure in which a second insulating layer and a second wiring layer are stacked. The RFIC inputs or outputs a base signal and a first radio frequency (RF) signal having a frequency higher than a frequency of the base signal, and the first FEIC inputs or outputs the first RF signal and a second RF signal.

    CHIP RADIO FREQUENCY PACKAGE AND RADIO FREQUENCY MODULE
    9.
    发明申请
    CHIP RADIO FREQUENCY PACKAGE AND RADIO FREQUENCY MODULE 有权

    公开(公告)号：US20210242896A1

    公开(公告)日：2021-08-05

    申请号：US16994955

    申请日：2020-08-17

    Applicant: Samsung Electro-Mechanics Co., Ltd.

    Inventor： Hak Gu KIM ,  Ho Kyung KANG ,  Seong Jong CHEON ,  Young Sik HUR ,  Jin Seon PARK ,  Yong Duk LEE

    IPC: H04B1/40 ,  H01Q9/04 ,  H01Q1/22 ,  H01L23/66 ,  H01L25/065 ,  H01L23/538

    Abstract: A chip radio frequency package includes a substrate including a first cavity, first and second connection members, a core member, a radio frequency integrated circuit (RFIC) disposed on an upper surface of the substrate, and a first front-end integrated circuit (FEIC) disposed in the first cavity. The core member includes a core insulating layer and a core via that penetrates the core insulating layer. The first connection member has a structure in which a first insulating layer and a first wiring layer are stacked. The second connection member has a second structure in which a second insulating layer and a second wiring layer are stacked. The RFIC inputs or outputs a base signal and a first radio frequency (RF) signal having a frequency higher than a frequency of the base signal, and the first FEIC inputs or outputs the first RF signal and a second RF signal.

    CHIP RADIO FREQUENCY PACKAGE AND RADIO FREQUENCY MODULE
    10.
    发明申请
    CHIP RADIO FREQUENCY PACKAGE AND RADIO FREQUENCY MODULE 有权

    公开(公告)号：US20210242594A1

    公开(公告)日：2021-08-05

    申请号：US16891200

    申请日：2020-06-03

    Applicant: Samsung Electro-Mechanics Co., Ltd.

    Inventor： Ho Kyung KANG ,  Seong Jong CHEON ,  Hak Gu KIM ,  Young Sik HUR ,  Jin Seon PARK ,  Yong Duk LEE

    IPC: H01Q9/04 ,  H01Q1/22 ,  H01Q1/38 ,  H01Q5/35

    Abstract: A radio frequency module is provided. The module includes a core member, a front-end integrated circuit (FEIC), a first connection member, a second connection member disposed on an upper surface of the core member, a radio frequency integrated circuit (RFIC) disposed on an upper surface of the second connection member, and configured to input or output a base signal and a first radio frequency (RF) signal having a frequency higher than a frequency of the base signal, through a wiring layer, a substrate disposed on a lower surface of the first connection member; and an electrical connection structure configured to electrically connect the first connection member and the substrate. The FEIC is configured to input or output the first RF signal and a second RF signal which has a power different from a power of the first RF signal.

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