公开(公告)号：US20240290543A1

公开(公告)日：2024-08-29

申请号：US18519370

申请日：2023-11-27

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hyung Soon KWON ,  Hyoung Uk KIM ,  Han Seong JUNG ,  Ji Su HONG ,  Hye Won RYOO ,  Jae Sung PARK

IPC: H01G4/30 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12

CPC classification number: H01G4/30 ,  H01G4/008 ,  H01G4/012 ,  H01G4/1209

Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode disposed alternately with the dielectric layer in a first direction, and an external electrode disposed on the outside of the body and connected to the internal electrode. The dielectric layer includes a first layer and a second layer stacked in the first direction, and each of the first layer and the second layer includes Ba, Ti, and Si. 1.5≤S2/S1≤3.0 is satisfied, when a molar ratio of Si to Ti included in the first layer is referred to as Si and a molar ratio of Si to Ti included in the second layer is referred to as S2.

公开(公告)号：US20240282525A1

公开(公告)日：2024-08-22

申请号：US18414789

申请日：2024-01-17

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hye Won RYOO ,  Kyung Sik KIM ,  Seung In BAIK ,  Min Young CHOI ,  Jong Hwan LEE ,  Hyung Soon KWON

IPC: H01G4/12 ,  H01G4/30

CPC classification number: H01G4/1227 ,  H01G4/30 ,  H01G4/0085 ,  H01G4/012 ,  H01G4/2325

Abstract: A multilayer electronic component includes a body including dielectric layers and internal electrodes; and an external electrode disposed on the body. The body includes a capacitance forming portion including the dielectric layers and the internal electrodes in a first direction, and a cover portion disposed on both end-surfaces of the capacitance forming portion in the first direction. One of the dielectric layers includes a first acceptor element containing Al, a second acceptor element containing at least one of Mg, Mn, or V, and Ti. The one of the dielectric layers and the cover portion include a plurality of dielectric grains, and a ratio (G1/G2) of an average size (G1) of the plurality of dielectric grains included in the one of the dielectric layers relative to an average size (G2) of the plurality of dielectric grains included in the cover portion satisfies 1.00≤G1/G2