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公开(公告)号：US11594376B2
公开(公告)日：2023-02-28
申请号：US17208181
申请日：2021-03-22
发明人： Beom Joon Cho , Won Young Jang , Hyeok Jin Park
摘要： An electronic component and a board having the same mounted thereon are provided. The electronic component includes an electronic component including a capacitor array in which a plurality of multilayer capacitors including a capacitor body and a pair of external electrodes, respectively disposed on both end portions of the capacitor body in a first direction, are stacked in a second direction, perpendicular to the first direction, and a length of a multilayer capacitor, disposed on a lower end in the second direction, in the first direction is less than a length of another multilayer capacitor in the first direction; and a pair of metal frames, respectively disposed to be connected to the pair of external electrodes of the multilayer capacitor disposed on the lower end.
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公开(公告)号：US20220076890A1
公开(公告)日：2022-03-10
申请号：US17208181
申请日：2021-03-22
发明人： Beom Joon Cho , Won Young Jang , Hyeok Jin Park
摘要： An electronic component and a board having the same mounted thereon are provided. The electronic component includes an electronic component including a capacitor array in which a plurality of multilayer capacitors including a capacitor body and a pair of external electrodes, respectively disposed on both end portions of the capacitor body in a first direction, are stacked in a second direction, perpendicular to the first direction, and a length of a multilayer capacitor, disposed on a lower end in the second direction, in the first direction is less than a length of another multilayer capacitor in the first direction; and a pair of metal frames, respectively disposed to be connected to the pair of external electrodes of the multilayer capacitor disposed on the lower end.
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公开(公告)号：US20230223192A1
公开(公告)日：2023-07-13
申请号：US17978654
申请日：2022-11-01
发明人： Mina Hyun , Beomjoon Cho , Hyeok Jin Park , Won Young Jang
摘要： An electronic component according to an embodiment includes a multilayer capacitor, a frame terminal, and a conductive bonding portion. An area in which the conductive bonding portion contacts the frame terminal is larger than an area in which it contacts with the external electrode.
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