公开(公告)号：US20250120006A1

公开(公告)日：2025-04-10

申请号：US18776533

申请日：2024-07-18

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Dae Chul CHOI ,  Seung Bae LEE ,  Ye Ji KIM ,  Il Dong KIM ,  Woo Seok YANG ,  Ah Yeon IM ,  Kyoung Seok CHO ,  Jae Ho LEE

IPC: H05K1/02 ,  H01L23/498 ,  H01L25/16 ,  H05K1/11 ,  H05K1/18

Abstract: A printed circuit board includes a substrate; first and second through-portions penetrating between upper and lower surfaces of the substrate; a magnetic layer disposed in the first through-portion; a voltage regulator disposed in the second through-portion; a first through-hole penetrating between upper and lower surfaces of the magnetic layer; a first insulating layer disposed on the substrate, covering the magnetic layer and the voltage regulator, and filling the second through-portion and the first through-hole; a second through-hole penetrating between upper and lower surfaces of the first insulating layer in the first through-hole; a first wiring pattern disposed on an upper surface of the magnetic layer; a second wiring pattern disposed on a lower surface of the magnetic layer; and a first via pattern disposed in the second through-hole and connecting the first and second wiring patterns to each other.