公开(公告)号：US20250120006A1

公开(公告)日：2025-04-10

申请号：US18776533

申请日：2024-07-18

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Dae Chul CHOI ,  Seung Bae LEE ,  Ye Ji KIM ,  Il Dong KIM ,  Woo Seok YANG ,  Ah Yeon IM ,  Kyoung Seok CHO ,  Jae Ho LEE

IPC: H05K1/02 ,  H01L23/498 ,  H01L25/16 ,  H05K1/11 ,  H05K1/18

Abstract: A printed circuit board includes a substrate; first and second through-portions penetrating between upper and lower surfaces of the substrate; a magnetic layer disposed in the first through-portion; a voltage regulator disposed in the second through-portion; a first through-hole penetrating between upper and lower surfaces of the magnetic layer; a first insulating layer disposed on the substrate, covering the magnetic layer and the voltage regulator, and filling the second through-portion and the first through-hole; a second through-hole penetrating between upper and lower surfaces of the first insulating layer in the first through-hole; a first wiring pattern disposed on an upper surface of the magnetic layer; a second wiring pattern disposed on a lower surface of the magnetic layer; and a first via pattern disposed in the second through-hole and connecting the first and second wiring patterns to each other.

公开(公告)号：US20160300773A1

公开(公告)日：2016-10-13

申请号：US15061219

申请日：2016-03-04

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Young Doo LEE ,  Dae Chul CHOI

IPC: H01L23/31 ,  H01L25/065 ,  H01L23/00 ,  H01L25/00 ,  H01L21/56 ,  H01L23/498

CPC classification number: H01L23/49838 ,  H01L21/561 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/0346 ,  H01L2224/0401 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16238 ,  H01L2224/1713 ,  H01L2224/81192 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/81815

Abstract: There is provided a printed circuit board includes a substrate having product areas for mounting elements and dummy areas disposed between two neighboring product areas, external connection terminals disposed on the product areas, and a plurality of dummy bumps disposed on the dummy areas.

Abstract translation: 提供了一种印刷电路板，包括具有用于安装元件的产品区域和设置在两个相邻产品区域之间的虚拟区域的基板，以及设置在产品区域上的外部连接端子以及设置在虚拟区域上的多个虚设凸块。

公开(公告)号：US20230207185A1

公开(公告)日：2023-06-29

申请号：US18076715

申请日：2022-12-07

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yong Min KIM ,  Jae Hun KIM ,  Chang Yun LEE ,  Dae Chul CHOI ,  Se Yeon HWANG ,  Yeo Ok JEON

IPC: H01F27/29 ,  H01F27/28 ,  H01F17/04

CPC classification number: H01F27/292 ,  H01F27/2828 ,  H01F17/045 ,  H01F27/2804

Abstract: A coil component includes a body having a first surface, a coil including a coil pattern having a plurality of turns, a first and second lead-out portions disposed in the body and connected to one end and the other end of the coil, respectively, a first and second dummy lead-out portions disposed in the body and spaced apart from the coil, a first and second external electrodes disposed on the first surface of the body and connected to the first and second lead-out portions, respectively. A coil pattern closest to the first surface among the coil patterns disposed in a region between the first lead-out portion and the first dummy lead-out portion is connected to the first lead-out portion.

公开(公告)号：US20180286559A1

公开(公告)日：2018-10-04

申请号：US15783798

申请日：2017-10-13

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Soo Young JI ,  Hwan Soo YOO ,  Nam Soon MOON ,  Jeong Suong YANG ,  Tae Ho KIM ,  Dae Chul CHOI

IPC: H01F27/255 ,  H01F27/29 ,  H01F27/28 ,  H05K1/18

Abstract: An electronic component includes: a body having electrical insulating properties; an external electrode disposed on an external surface of the body; and a reinforcing layer disposed on a surface of the body and including a metal oxide layer and a graphene oxide layer.