公开(公告)号：US20220375688A1

公开(公告)日：2022-11-24

申请号：US17523212

申请日：2021-11-10

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seok Hyun YOON ,  Jin Woo KIM ,  In Ho JEON ,  Joo Hee LEE

IPC: H01G4/12 ,  H01G4/30 ,  C04B35/468

Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body and connected to the internal electrode, wherein the dielectric layer includes first and second grains, wherein the first grain has a core-shell structure including a shell having an atomic ratio of 2*Sn/(Ba+Ti+Sn) or 2*Hf/(Ba+Ti+Hf) to be 1.0% or more and 5.0% or less, and a core having an atomic ratio of 2*Sn/(Ba+Ti+Sn) and 2*Hf/(Ba+Ti+Hf) to be less than 1.0%, and the second grain has an atomic ratio of 2*Sn/(Ba+Ti+Sn) and 2*Hf/(Ba+Ti+Hf) to be less than 1.0%, and wherein an area occupied by the first grain in an entire area of the first and second grains is 28.3-82.3%.