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公开(公告)号:US20240355547A1
公开(公告)日:2024-10-24
申请号:US18230854
申请日:2023-08-07
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Seok Hyun YOON , Hyung Soon KWON , In Ho JEON , Byung Ho LEE , Mi Yang KIM
CPC classification number: H01G4/30 , H01G4/008 , H01G4/012 , H01G4/1227
Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body, wherein the dielectric layer includes a rare earth element, a secondary phase of the rare earth element and a dielectric grain, wherein, when an average thickness of the dielectric layer is defined as td and a maximum size of the dielectric layer of a secondary phase of the rare earth element in the thickness direction is defined as D, the dielectric layer includes two or more secondary phases of a rare earth element satisfying D/td≤0.2.
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公开(公告)号:US20240234032A1
公开(公告)日:2024-07-11
申请号:US18136418
申请日:2023-04-19
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Bon Hyeong KOO , Seok Hyun YOON , In Ho JEON , Byung Kil YUN , Se Yong KIM , Min Jung JANG , Geon Hoi KIM
IPC: H01G4/12 , C04B35/626 , H01G4/008 , H01G4/012 , H01G4/30
CPC classification number: H01G4/1227 , C04B35/6262 , H01G4/008 , H01G4/012 , H01G4/30
Abstract: A multilayer electronic component includes a body including a dielectric layer and internal electrodes; and an external electrode disposed on the body, wherein the dielectric layer includes dielectric grains, wherein at least one of the dielectric grains includes a twin boundary, and wherein the dielectric layer includes a region in which a sum of lengths of the twin boundaries included in a 2 μm×2 μm region is 1.49 μm or more.
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公开(公告)号:US20240242888A1
公开(公告)日:2024-07-18
申请号:US18224709
申请日:2023-07-21
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Byung Kil YUN , Seok Hyun YOON , Jin Woo KIM , In Ho JEON , Bon Hyeong KOO , Se Yong KIM , Min Jung JANG , Geon Hoi KIM , Hyo Ju LEE
CPC classification number: H01G4/30 , H01G4/1227
Abstract: A multilayer electronic component includes a body including a dielectric layer and internal electrodes; and an external electrode disposed on the body, wherein the dielectric layer includes a boundary portion, a region adjacent to a boundary with the internal electrode, and wherein the boundary portion includes a region satisfying an atomic ratio: 1.0%≤Sn/(Ba+Ti+Sn)≤1.5%.
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公开(公告)号:US20240153705A1
公开(公告)日:2024-05-09
申请号:US18242833
申请日:2023-09-06
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: In Ho JEON , Seok Hyun YOON , Jin Woo KIM , Byung Kil YUN , Bon Hyeong KOO , Min Jung JANG , Mi Yang KIM
CPC classification number: H01G4/1227 , H01G4/0085 , H01G4/012 , H01G4/30
Abstract: A ceramic electronic component includes a body including a dielectric layer and an internal electrode disposed alternately with the dielectric layer; and an external electrode disposed on the body, wherein the dielectric layer includes a first region extending from an interfacial surface with the internal electrode to 50 nm of the dielectric layer in an inward direction and a second region excluding the first region, and wherein, in the first region, an average content of In based on overall elements excluding oxygen is 0.5 at % or more and 2.0 at % or less, and an average content of Sn based on overall elements excluding oxygen is 0.5 at % or more and 1.75 at % or less.
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公开(公告)号:US20220375688A1
公开(公告)日:2022-11-24
申请号:US17523212
申请日:2021-11-10
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Seok Hyun YOON , Jin Woo KIM , In Ho JEON , Joo Hee LEE
IPC: H01G4/12 , H01G4/30 , C04B35/468
Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body and connected to the internal electrode, wherein the dielectric layer includes first and second grains, wherein the first grain has a core-shell structure including a shell having an atomic ratio of 2*Sn/(Ba+Ti+Sn) or 2*Hf/(Ba+Ti+Hf) to be 1.0% or more and 5.0% or less, and a core having an atomic ratio of 2*Sn/(Ba+Ti+Sn) and 2*Hf/(Ba+Ti+Hf) to be less than 1.0%, and the second grain has an atomic ratio of 2*Sn/(Ba+Ti+Sn) and 2*Hf/(Ba+Ti+Hf) to be less than 1.0%, and wherein an area occupied by the first grain in an entire area of the first and second grains is 28.3-82.3%.
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