公开(公告)号：US20250125093A1

公开(公告)日：2025-04-17

申请号：US18816293

申请日：2024-08-27

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ki Hun JEON ,  Ji Won LEE ,  Sang Yeop KIM

IPC: H01G4/224 ,  H01G2/24 ,  H01G4/232 ,  H01G4/30

Abstract: A multilayer electronic component may include: a body including a capacitance formation portion including a dielectric layer and an internal electrode alternately disposed with the dielectric layer in a first direction, an upper cover portion disposed above the capacitance formation portion in the first direction, a lower cover portion disposed below the capacitance formation portion in the first direction, and an identification portion disposed above the upper cover portion in the first direction; and an external electrode disposed on the body, and an average thickness of the lower cover portion may be greater than an average thickness of the upper cover portion, and the identification portion may include a water-repellent material and a non-conductive heat-resistant paint.