公开(公告)号：US20230170143A1

公开(公告)日：2023-06-01

申请号：US17693813

申请日：2022-03-14

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Je Jung KIM ,  Ji Won LEE ,  Ye Jin JEONG ,  Jae Joon LEE

IPC: H01G4/12 ,  H01G4/30 ,  H01G4/248 ,  H01G4/232

CPC classification number: H01G4/12 ,  H01G4/30 ,  H01G4/248 ,  H01G4/232

Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, a first external electrode disposed on the body and connected to the first internal electrode, and a second external electrode disposed on the body and connected to the second internal electrode. The dielectric layer includes a first dielectric layer adjacent to the first internal electrode, a second dielectric layer adjacent to the second internal electrode, and a third dielectric layer disposed between the first and second dielectric layers. D1

公开(公告)号：US20210183579A1

公开(公告)日：2021-06-17

申请号：US16852811

申请日：2020-04-20

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Je Jung KIM ,  Su Kyoung CHA ,  Ji Won LEE ,  Seung Ryeol LEE

IPC: H01G4/30 ,  H01G4/012 ,  H01G4/12 ,  H01G2/06

Abstract: An electronic component includes a capacitor body having first to sixth surfaces, the capacitor body including a plurality of dielectric layers stacked in a first direction connecting the fifth and sixth surfaces and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween; first and second external electrodes disposed on the first surface of the capacitor body, to be spaced apart from each other in a second direction connecting the third and fourth surfaces; and first and second metal frames connected to the first and second external electrodes, respectively. The first internal electrode includes a first lead portion exposed through the first surface of the capacitor body and connected to the first external electrode. The second internal electrode includes a second lead portion exposed through the first surface of the capacitor body and connected to the second external electrode.

公开(公告)号：US20210183572A1

公开(公告)日：2021-06-17

申请号：US16862895

申请日：2020-04-30

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Je Jung KIM ,  Su Kyoung CHA ,  Ji Won LEE ,  Seung Ryeol LEE

IPC: H01G4/12 ,  H01G4/012

Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric layer including a grain and first and second internal electrodes stacked in a third direction with the dielectric layer interposed therebetween, and including a first surface and a second surface opposing each other in a third direction, a third surface and a fourth surface opposing each other in a second direction, and a fifth surface and a sixth surface opposing each other in a first direction; and first and second external electrodes disposed on the fifth surface and the sixth surface of the ceramic body, respectively, and a ratio, G/I, of a particle size, G, of a grain of the dielectric layer to a thickness, I, of each of the first and second internal electrodes is 0.3 or more and 0.5 or less.

公开(公告)号：US20250125093A1

公开(公告)日：2025-04-17

申请号：US18816293

申请日：2024-08-27

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ki Hun JEON ,  Ji Won LEE ,  Sang Yeop KIM

IPC: H01G4/224 ,  H01G2/24 ,  H01G4/232 ,  H01G4/30

Abstract: A multilayer electronic component may include: a body including a capacitance formation portion including a dielectric layer and an internal electrode alternately disposed with the dielectric layer in a first direction, an upper cover portion disposed above the capacitance formation portion in the first direction, a lower cover portion disposed below the capacitance formation portion in the first direction, and an identification portion disposed above the upper cover portion in the first direction; and an external electrode disposed on the body, and an average thickness of the lower cover portion may be greater than an average thickness of the upper cover portion, and the identification portion may include a water-repellent material and a non-conductive heat-resistant paint.

公开(公告)号：US20210065988A1

公开(公告)日：2021-03-04

申请号：US16864695

申请日：2020-05-01

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Je Jung KIM ,  Seung Ryeol LEE ,  Ji Won LEE

IPC: H01G4/30 ,  H01G4/012 ,  H01G4/12 ,  H01G4/008 ,  H01G2/06

Abstract: A multilayer electronic component includes a body, a protrusion disposed on at least one surface of the body, and an external electrode having an electrode layer disposed on a side surface of the body and extending to be in contact with a side surface of the protrusion and a conductive resin layer disposed on the electrode layer and extending to cover a portion of the protrusion.

公开(公告)号：US20210183580A1

公开(公告)日：2021-06-17

申请号：US16854248

申请日：2020-04-21

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Je Jung KIM ,  Su Kyoung CHA ,  Ji Won LEE ,  Seung Ryeol LEE

IPC: H01G4/30 ,  H01G4/012 ,  H01G4/12 ,  H01G2/06

Abstract: An electronic component includes a capacitor body having first to sixth surfaces, and including a plurality of dielectric layers and first and second internal electrodes; first and second external electrodes disposed on both ends of the capacitor body in a second direction in which the third and fourth surfaces oppose each other, respectively; a third external electrode disposed on the first surface of the capacitor body; and first to third metal frames connected to the first to third external electrodes, respectively, both ends of the first internal electrode are exposed through the third and fourth surfaces of the capacitor body, respectively, and the second internal electrode includes a lead portion exposed through the first surface of the capacitor body and connected to the third external electrode.