公开(公告)号：US20130094123A1

公开(公告)日：2013-04-18

申请号：US13693947

申请日：2012-12-04

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Young Ghyu AHN ,  Byoung Hwa LEE ,  Min Cheol PARK ,  Young Hoon SONG ,  Mi Hee LEE

IPC: H01G4/12

CPC classification number: H01G4/1272 ,  H01G2/065 ,  H01G4/005 ,  H01G4/12 ,  H01G4/228 ,  H01G4/232 ,  H01G4/30

Abstract: There is provided a chip type laminated capacitor including: a ceramic body formed by laminating a dielectric layer having a thickness equal to 10 or more times an average particle diameter of a grain included therein and being 3 μm or less; first and second outer electrodes; a first inner electrode having one end forming a first margin together with one end surface of the ceramic body at which the second outer electrode is formed and the other end leading to the first outer electrode; and a second inner electrode having one end forming a second margin together with the other end surface of the ceramic body at which the first outer electrode is formed and the other end leading to the second outer electrode, wherein the first and second margins have different widths under a condition that they are 200 μm or less.

Abstract translation: 提供一种片式叠层电容器，其包括：陶瓷体，其通过层叠厚度等于其中包含的颗粒的平均粒径的10倍或更多倍的3μm或更小的电介质层而形成; 第一和第二外部电极; 第一内部电极，其一端与形成有第二外部电极的陶瓷体的一个端面一起形成第一边缘，而另一端通向第一外部电极; 以及第二内部电极，其一端与形成有第一外部电极的陶瓷体的另一个端面一起形成第二边缘，另一端通向第二外部电极，其中第一和第二边缘具有不同的宽度 条件是他们是200毫米或更少。