公开(公告)号：US20240234032A1

公开(公告)日：2024-07-11

申请号：US18136418

申请日：2023-04-19

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Bon Hyeong KOO ,  Seok Hyun YOON ,  In Ho JEON ,  Byung Kil YUN ,  Se Yong KIM ,  Min Jung JANG ,  Geon Hoi KIM

IPC: H01G4/12 ,  C04B35/626 ,  H01G4/008 ,  H01G4/012 ,  H01G4/30

CPC classification number: H01G4/1227 ,  C04B35/6262 ,  H01G4/008 ,  H01G4/012 ,  H01G4/30

Abstract: A multilayer electronic component includes a body including a dielectric layer and internal electrodes; and an external electrode disposed on the body, wherein the dielectric layer includes dielectric grains, wherein at least one of the dielectric grains includes a twin boundary, and wherein the dielectric layer includes a region in which a sum of lengths of the twin boundaries included in a 2 μm×2 μm region is 1.49 μm or more.

公开(公告)号：US20240242888A1

公开(公告)日：2024-07-18

申请号：US18224709

申请日：2023-07-21

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Byung Kil YUN ,  Seok Hyun YOON ,  Jin Woo KIM ,  In Ho JEON ,  Bon Hyeong KOO ,  Se Yong KIM ,  Min Jung JANG ,  Geon Hoi KIM ,  Hyo Ju LEE

IPC: H01G4/30 ,  H01G4/12

CPC classification number: H01G4/30 ,  H01G4/1227

Abstract: A multilayer electronic component includes a body including a dielectric layer and internal electrodes; and an external electrode disposed on the body, wherein the dielectric layer includes a boundary portion, a region adjacent to a boundary with the internal electrode, and wherein the boundary portion includes a region satisfying an atomic ratio: 1.0%≤Sn/(Ba+Ti+Sn)≤1.5%.