公开(公告)号：US12230445B2

公开(公告)日：2025-02-18

申请号：US18136418

申请日：2023-04-19

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Bon Hyeong Koo ,  Seok Hyun Yoon ,  In Ho Jeon ,  Byung Kil Yun ,  Se Yong Kim ,  Min Jung Jang ,  Geon Hoi Kim

IPC: H01G4/12 ,  C04B35/626 ,  H01G4/008 ,  H01G4/012 ,  H01G4/30

Abstract: A multilayer electronic component includes a body including a dielectric layer and internal electrodes; and an external electrode disposed on the body, wherein the dielectric layer includes dielectric grains, wherein at least one of the dielectric grains includes a twin boundary, and wherein the dielectric layer includes a region in which a sum of lengths of the twin boundaries included in a 2 μm×2 μm region is 1.49 μm or more.