公开(公告)号：US20250118473A1

公开(公告)日：2025-04-10

申请号：US18888719

申请日：2024-09-18

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hyo Ki HONG ,  Su Rim BAE ,  Seok Hee LEE ,  Min Seon KWON ,  Woong Sup LEE ,  Ji Min KIM ,  Joong Won PARK ,  Il Jin PARK ,  Jung Wook SEO ,  Jae Hee JU

IPC: H01F3/08 ,  H01F1/147

Abstract: A magnetic component includes a magnetic body, wherein the magnetic body includes a plurality of magnetic particles including an Fe-based alloy, at least a portion of magnetic particles, among the plurality of magnetic particles, include a first layer disposed on surfaces of the at least a portion of magnetic particles and a second layer disposed on a surface of the first layer, the first layer includes an Fe oxide component and has an average thickness of less than 5 nm, and the second layer includes an Si oxide component and has an average thickness of 5 nm or more.

公开(公告)号：US20220189676A1

公开(公告)日：2022-06-16

申请号：US17241351

申请日：2021-04-27

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Joong Won PARK ,  Il Jin PARK ,  Se Hyung LEE ,  Jun Sung LEE ,  Seok Hee LEE ,  Ji Hwan SHIN

IPC: H01F27/255 ,  H01F27/29 ,  H01F17/00

Abstract: A coil electronic component includes a body including a coil portion therein, and including a plurality of magnetic particles including an Fe-based alloy component, and an external electrode connected to the coil portion, wherein at least a portion of the plurality of magnetic particles include a first layer formed on a surface, and a second layer formed on a surface of the first layer, wherein the first layer includes an Fe oxide component and has a thickness of 10 nm or less.