公开(公告)号：US20250166918A1

公开(公告)日：2025-05-22

申请号：US18949088

申请日：2024-11-15

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hyung Jong CHOI ,  Chung Eun LEE ,  Yong Min KIM ,  Kwan Hee YUN ,  Seon Ho KIM

IPC: H01G4/232 ,  H01G4/30

Abstract: A multilayer electronic component includes a first external electrode including a first connection portion disposed on a third surface of a body, and a first band portion extending from the first connection portion onto a portion of a first surface of the body and a portion of a second surface of the body, wherein the first external electrode includes a first electrode layer connected to the first internal electrode, and a first conductive resin layer disposed on the first electrode layer in the first band portion and including a second conductive metal and a thermosetting resin, the first electrode layer includes a first conductive metal and glass, and the first conductive resin layer is not disposed on the first connection portion.

公开(公告)号：US20250166924A1

公开(公告)日：2025-05-22

申请号：US18922823

申请日：2024-10-22

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seon Ho KIM

IPC: H01G4/30 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12 ,  H01G4/232

Abstract: A multilayer electronic component includes a body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer in a first direction, and including first and second surfaces opposing each other in the first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction; and external electrodes including connection portions disposed on the third and fourth surfaces, respectively, and band portions extending from the respective connection portions onto a portion of the first surface and a portion of the second surface. The external electrodes each include an electrode layer connected to one of the internal electrodes, and a first plating layer disposed on the electrode layer, and a metal layer including a conductive metal and glass is interposed between the electrode layer and the body in the band portions.