公开(公告)号：US20200374426A1

公开(公告)日：2020-11-26

申请号：US16750344

申请日：2020-01-23

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Won Seo GU ,  Soo Gil SIN ,  Sang Jin KIM

IPC: H04N5/225

Abstract: A camera module includes a lens; an image sensor disposed on a substrate and converting an optical signal refracted by the lens into an electrical signal, an adhesive member disposed between the substrate and the image sensor to fix the image sensor to the substrate, and a support member disposed between the substrate and the image sensor configured to maintain a constant distance between the lens and the image sensor even at a time of shrinkage-deformation of the adhesive member.

公开(公告)号：US20190320095A1

公开(公告)日：2019-10-17

申请号：US15954302

申请日：2018-04-16

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sang Jin KIM ,  Soo Gil SIN ,  Young Rok PARK

IPC: H04N5/225

Abstract: A camera module includes : a housing in which a lens barrel is accommodated; a circuit board fixedly mounted on a lower portion of the housing; and a guide member guiding a fixing position of the housing fixed to the circuit board, wherein the guide member includes a solder ball, formed on the circuit board to protrude in an upward optical axis direction and a guide groove, provided as a groove recessed in the upward optical axis direction in a lower end portion of the housing and into which the solder ball is fitted.