公开(公告)号：US20230217093A1

公开(公告)日：2023-07-06

申请号：US17970852

申请日：2022-10-21

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Won Seo GU ,  Sung Jae LEE ,  Young Rok PARK

IPC: H04N5/225

CPC classification number: H04N5/2257 ,  H04N5/2252 ,  H04N5/2254 ,  H04N5/2253

Abstract: An image sensor module is provided. The image sensor module includes an image sensor which has a rectangular shape having a long side and a short side; a substrate which has a long side corresponding to the long side of the image sensor and a short side corresponding to the short side of the image sensor, wherein the image sensor is mounted on the substrate; a sub-housing installed on the substrate, the sub-housing having a first sidewall disposed on a side corresponding to the long side of the image sensor and a second sidewall disposed on a side corresponding to the short side of the image sensor; and an adhesive which bonds the sub-housing and the substrate, wherein a side surface of the substrate, disposed on the long side of the substrate and an outer surface of the adhesive are disposed on a same plane.

公开(公告)号：US20210074750A1

公开(公告)日：2021-03-11

申请号：US16826481

申请日：2020-03-23

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Won Seo GU ,  Sang Jin KIM

IPC: H01L27/146 ,  H04N5/225

Abstract: An image sensor package includes a substrate connected to an image sensor by a bonding wire; a sub-housing disposed adjacent to an upper surface of the substrate so as to surround the bonding wire; and a support member disposed at least partially in a space between the sub-housing and the substrate to limit elastic deformation of the sub-housing, and a portion of the bonding wire is disposed inside the support member.

公开(公告)号：US20200374426A1

公开(公告)日：2020-11-26

申请号：US16750344

申请日：2020-01-23

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Won Seo GU ,  Soo Gil SIN ,  Sang Jin KIM

IPC: H04N5/225

Abstract: A camera module includes a lens; an image sensor disposed on a substrate and converting an optical signal refracted by the lens into an electrical signal, an adhesive member disposed between the substrate and the image sensor to fix the image sensor to the substrate, and a support member disposed between the substrate and the image sensor configured to maintain a constant distance between the lens and the image sensor even at a time of shrinkage-deformation of the adhesive member.