公开(公告)号：US20230360855A1

公开(公告)日：2023-11-09

申请号：US18135328

申请日：2023-04-17

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Dong Geon YOO ,  Su Been KIM ,  Dong Jun JUNG

IPC: H01G4/30 ,  H01G4/12 ,  H01G4/012 ,  H01G4/008 ,  C04B35/468 ,  C04B35/64

CPC classification number: H01G4/30 ,  C04B35/4682 ,  C04B35/64 ,  H01G4/008 ,  H01G4/012 ,  H01G4/1227

Abstract: A multilayer electronic component including a dielectric layer is provided. The dielectric layer includes a plurality of dielectric grains, and at least one of the plurality of dielectric grains has a core-interface shell-shell structure. The dielectric grain having the core-interface shell-shell structure includes a perovskite (BaTiO3) -based base main component, a first subcomponent including silicon (Si), and a second subcomponent including at least one selected from the group consisting of manganese (Mn), vanadium (V), chromium (Cr), iron (Fe), nickel (Ni), cobalt (Co), copper (Cu), zinc (Zn), and tin (Sn). An average content of the first subcomponent is highest in the first interface shell region, and an average content of the second subcomponent is highest in the second interface shell region.

公开(公告)号：US20220189694A1

公开(公告)日：2022-06-16

申请号：US17529721

申请日：2021-11-18

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Woo KIM ,  Jong Suk JEONG ,  Jong Hoon YOO ,  Chun Hee SEO ,  Jeong Wook SEO ,  Dong Geon YOO ,  Dong Hun KIM ,  Su Been KIM

IPC: H01G4/12 ,  H01G4/30 ,  H01G4/248 ,  C04B35/468

Abstract: A multilayer capacitor includes a body including a plurality of dielectric layers, and a plurality of internal electrodes stacked with one of the dielectric layers interposed therebetween, and external electrodes disposed on external surfaces of the body and connected to the internal electrodes, respectively. The plurality of dielectric layers include a dielectric expressed by empirical formula BaM1aTi1-xSnxM2bO3 (0.008≤x≤0.05, 0.006≤a≤0.03, and 0.0006≤b ≤0.006) in which M1 includes a rare earth element, and M2 includes at least one of Mn or V.

公开(公告)号：US20220199324A1

公开(公告)日：2022-06-23

申请号：US17549004

申请日：2021-12-13

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chun Hee SEO ,  Jong Suk JEONG ,  Jin Woo KIM ,  Tae Hyung KIM ,  Jeong Wook SEO ,  Dong Geon YOO ,  Jong Hoon YOO ,  Su Been KIM

IPC: H01G2/00 ,  H01G4/30 ,  H01G4/248 ,  H05K1/18 ,  H05K1/11

Abstract: A multilayer capacitor includes a capacitor body including an active region having dielectric layers and internal electrodes alternately stacked therein, the capacitor body including upper and lower covers disposed on upper and lower surfaces of the active region, respectively; and an external electrode disposed on an external surface of the capacitor body. In one of the upper and lower covers, a portion thereof between a boundary surface of the active region and a boundary surface of the capacitor body is divided into a first cover region adjacent to the active region and a second cover region adjacent to the boundary surface of the capacitor body, and the first cover region includes grains having a core-shell structure doped with Sn. The first cover region includes 20% or more of Sn-doped core-shell structure grains, compared to the total of grains in the first cover region.