公开(公告)号：US20230360855A1

公开(公告)日：2023-11-09

申请号：US18135328

申请日：2023-04-17

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Dong Geon YOO ,  Su Been KIM ,  Dong Jun JUNG

IPC: H01G4/30 ,  H01G4/12 ,  H01G4/012 ,  H01G4/008 ,  C04B35/468 ,  C04B35/64

CPC classification number: H01G4/30 ,  C04B35/4682 ,  C04B35/64 ,  H01G4/008 ,  H01G4/012 ,  H01G4/1227

Abstract: A multilayer electronic component including a dielectric layer is provided. The dielectric layer includes a plurality of dielectric grains, and at least one of the plurality of dielectric grains has a core-interface shell-shell structure. The dielectric grain having the core-interface shell-shell structure includes a perovskite (BaTiO3) -based base main component, a first subcomponent including silicon (Si), and a second subcomponent including at least one selected from the group consisting of manganese (Mn), vanadium (V), chromium (Cr), iron (Fe), nickel (Ni), cobalt (Co), copper (Cu), zinc (Zn), and tin (Sn). An average content of the first subcomponent is highest in the first interface shell region, and an average content of the second subcomponent is highest in the second interface shell region.

公开(公告)号：US20220189694A1

公开(公告)日：2022-06-16

申请号：US17529721

申请日：2021-11-18

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Woo KIM ,  Jong Suk JEONG ,  Jong Hoon YOO ,  Chun Hee SEO ,  Jeong Wook SEO ,  Dong Geon YOO ,  Dong Hun KIM ,  Su Been KIM

IPC: H01G4/12 ,  H01G4/30 ,  H01G4/248 ,  C04B35/468

Abstract: A multilayer capacitor includes a body including a plurality of dielectric layers, and a plurality of internal electrodes stacked with one of the dielectric layers interposed therebetween, and external electrodes disposed on external surfaces of the body and connected to the internal electrodes, respectively. The plurality of dielectric layers include a dielectric expressed by empirical formula BaM1aTi1-xSnxM2bO3 (0.008≤x≤0.05, 0.006≤a≤0.03, and 0.0006≤b ≤0.006) in which M1 includes a rare earth element, and M2 includes at least one of Mn or V.

公开(公告)号：US20250125097A1

公开(公告)日：2025-04-17

申请号：US18775131

申请日：2024-07-17

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jong Hoon YOO ,  Ji Hyun LEE ,  Dong Geon YOO ,  Eun Hye CHO

IPC: H01G4/30 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12

Abstract: A multilayer electronic component includes a body including a dielectric layer and first and second internal electrodes, the body having a first surface and a second surface opposing each other in a first direction, a third surface and a fourth surface opposing each other in a second direction, and a fifth surface and a sixth surface opposing each other in a third direction, an external electrode including a lower electrode layer, the lower electrode layer disposed between extension lines of the first and second surfaces, an upper electrode layer disposed on the lower electrode layer, the upper electrode layer disposed to extend onto a portion of the first and the second surfaces, and a glass layer disposed between the lower and upper electrode layers. The lower electrode layer includes Ag and a first glass. The upper electrode layer includes Cu and a second glass.

公开(公告)号：US20250132093A1

公开(公告)日：2025-04-24

申请号：US18781000

申请日：2024-07-23

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jong Hoon YOO ,  Ji Hyun LEE ,  Dong Geon YOO ,  Eun Hye CHO

IPC: H01G4/232 ,  H01G4/008 ,  H01G4/12 ,  H01G4/30

Abstract: A multilayer electronic component according to an embodiment of the present disclosure includes a body including a dielectric layer and an internal electrode; and an external electrode including an electrode layer disposed on the body and connected to the internal electrode, and a plating layer disposed on the electrode layer, wherein the electrode layer includes a connection electrode layer including copper (Cu) and glass, and a band electrode layer including silver (Ag) and glass, and the external electrode further includes a conductive resin layer disposed between the band electrode layer and the plating layer and including a conductive metal and a resin.

公开(公告)号：US20220199324A1

公开(公告)日：2022-06-23

申请号：US17549004

申请日：2021-12-13

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chun Hee SEO ,  Jong Suk JEONG ,  Jin Woo KIM ,  Tae Hyung KIM ,  Jeong Wook SEO ,  Dong Geon YOO ,  Jong Hoon YOO ,  Su Been KIM

IPC: H01G2/00 ,  H01G4/30 ,  H01G4/248 ,  H05K1/18 ,  H05K1/11

Abstract: A multilayer capacitor includes a capacitor body including an active region having dielectric layers and internal electrodes alternately stacked therein, the capacitor body including upper and lower covers disposed on upper and lower surfaces of the active region, respectively; and an external electrode disposed on an external surface of the capacitor body. In one of the upper and lower covers, a portion thereof between a boundary surface of the active region and a boundary surface of the capacitor body is divided into a first cover region adjacent to the active region and a second cover region adjacent to the boundary surface of the capacitor body, and the first cover region includes grains having a core-shell structure doped with Sn. The first cover region includes 20% or more of Sn-doped core-shell structure grains, compared to the total of grains in the first cover region.

公开(公告)号：US20210166881A1

公开(公告)日：2021-06-03

申请号：US16877902

申请日：2020-05-19

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Dong Hun KIM ,  Hyun Min LEE ,  Jong Suk JEONG ,  Dong Geon YOO ,  Ji Hyun LEE ,  Seok Hyun YOON

IPC: H01G4/30 ,  H01G4/012

Abstract: A multilayer ceramic capacitor includes a ceramic body including a dielectric layer, a plurality of first and second internal electrodes disposed inside the ceramic body, exposed to the first and second surfaces, and having ends exposed to the third or fourth surface, and a first side margin portion and a second side margin portion disposed on side portions of the plurality of first and second internal electrodes exposed to the first and second surfaces. A ratio Db/Da satisfies 1.00 to 1.07, inclusive, where ‘Db’ is a distance, in a stacking direction of the dielectric layer, between both end points of respective edge regions of the first side margin portion and the second side margin portion, and ‘Da’ is a distance in a central region of the ceramic body in the stacking direction.