公开(公告)号：US20200075246A1

公开(公告)日：2020-03-05

申请号：US16177912

申请日：2018-11-01

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Tae Jun KIM ,  Jang Yeol LEE ,  Jong Ho LEE ,  Myung Jun PARK

IPC: H01G4/232 ,  H01G4/30 ,  H01G4/248 ,  H01G4/12 ,  H01G4/008

Abstract: A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and a plurality of internal electrodes disposed to face each other with each of the dielectric layers interposed therebetween; and external electrodes disposed on external surfaces of the ceramic body and electrically connected to the internal electrodes, respectively, wherein the external electrode includes an electrode layer electrically connected to the internal electrodes and a conductive resin layer disposed on the electrode layer, and a sum of thicknesses of the electrode layer and the conductive resin layer in a cross section of the ceramic body in the first and second directions is 12 μm or more.