公开(公告)号：US20240355549A1

公开(公告)日：2024-10-24

申请号：US18603754

申请日：2024-03-13

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ye Rin HONG ,  Kyong Nam HWANG ,  Jong Suk JEONG ,  Yang-Seok PARK ,  Hye Mi YOO ,  Seung Min LEE

IPC: H01G4/30 ,  H01G4/012 ,  H01G4/12 ,  H01G4/232

CPC classification number: H01G4/30 ,  H01G4/012 ,  H01G4/1227 ,  H01G4/2325

Abstract: A multilayer electronic component includes a body including a dielectric layer and internal electrodes disposed alternately with the dielectric layer in a first direction; a first side margin portion and a second side margin portion disposed on opposing side surfaces of the body; a first external electrode and a second external electrode disposed on opposing end surfaces of the body. When an average size of the first side margin portion is defined as W1, an average size of the second side margin portion is defined as W2, and an average size between external surfaces of the first and second side margin portions is defined as W0, (W1+W2)/W0 td is satisfied.