DIODE DEVICE AND METHOD OF MANUFACTURING THE SAME
    1.
    发明申请
    DIODE DEVICE AND METHOD OF MANUFACTURING THE SAME 审中-公开
    二极管器件及其制造方法

    公开(公告)号:US20150179826A1

    公开(公告)日:2015-06-25

    申请号:US14274084

    申请日:2014-05-09

    IPC分类号: H01L29/872 H01L29/66

    摘要: A diode device may include: a first semiconductor area having a first conductivity type; a second semiconductor area having a second conductivity type, provided on the first semiconductor area and having a uniform impurity density; a trench provided to pass through the second semiconductor area to contact the first semiconductor area; and a first metal layer provided on surfaces of the trench and the second semiconductor area.

    摘要翻译: 二极管器件可以包括:具有第一导电类型的第一半导体区域; 具有第二导电类型的第二半导体区域,设置在第一半导体区域上并具有均匀的杂质密度; 设置成通过所述第二半导体区域以与所述第一半导体区域接触的沟槽; 以及设置在所述沟槽和所述第二半导体区域的表面上的第一金属层。