公开(公告)号：US20250100018A1

公开(公告)日：2025-03-27

申请号：US18750326

申请日：2024-06-21

Applicant: SAMSUNG ELECTRONICS CO, LTD.

Inventor： Jonggun SONG ,  Yunseok CHOI ,  Eunseok LEE ,  Jaeock CHOI

IPC: B08B1/12 ,  B08B1/40 ,  B08B11/00 ,  B24B53/017

Abstract: A chemical mechanical polishing device includes a frame providing lower and upper spaces in the frame and including a flat plate portion that separates the lower and upper spaces from each other and has a first hole, a driving roller in the lower space and configured to rotate in place, a cleaning assembly in the upper space and configured to reciprocate in a first horizontal direction parallel to an upper surface of the flat plate portion, and a driver extending from the upper space to the lower space through the first hole of the flat plate portion and having one end connected to a base of the driving roller and the other end opposite to the one end and connected to the cleaning assembly, wherein the cleaning assembly includes brushes arranged apart from each other in the first horizontal direction and nozzles arranged respectively between the brushes.