公开(公告)号：US20230361051A1

公开(公告)日：2023-11-09

申请号：US18113910

申请日：2023-02-24

Applicant: SAMSUNG ELECTRONICS CO, LTD.

Inventor： Choongbin YIM ,  Hyonchol KIM ,  Sungbum KIM ,  Gitae PARK ,  Jiyong PARK ,  Jinwoo PARK ,  Jongbo SHIM

IPC: H01L25/16 ,  H01L23/498 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L23/562 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/16 ,  H01L25/16 ,  H01L21/4853 ,  H01L24/81 ,  H01L2224/16227 ,  H01L2224/81815

Abstract: A semiconductor package includes: a package substrate including a redistribution layer, a lower protective layer, and a plurality of support protrusions, wherein the redistribution layer has first and second pads disposed on the package substrate, wherein the lower protective layer has first openings and a trench, wherein the trench exposes the second pads, and wherein the plurality of support protrusions are disposed in the trench; a semiconductor chip disposed on the package substrate and including connection pads electrically connected to the redistribution layer; an encapsulant disposed on at least a portion of the semiconductor chip; first connection bumps electrically connected to the first pads, respectively; a passive device disposed in the trench of the lower protective layer and electrically connected to the second pads; and a sealant covering at least a portion of the passive device and extending into the trench.