公开(公告)号：US20250105517A1

公开(公告)日：2025-03-27

申请号：US18903650

申请日：2024-10-01

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sanghoon CHOI ,  Youngjung Kim ,  Jonghoon Kim ,  Dongjun Oh ,  Himchan Yun ,  Youngsung Lee ,  Aro Cheon

IPC: H01Q5/50 ,  H01Q1/50

Abstract: An electronic device includes: a conductive portion; a printed circuit board having a first ground path, a second ground path, and a feed path; and a wireless communication circuit on the printed circuit board. The conductive portion includes a feed point, a first ground point, and a second ground point. The first ground point is connected to a ground of the electronic device through the first ground path. The second ground point is connected to the ground through the second ground path. The feed point is electrically connected to the wireless communication circuit through the feed path. The printed circuit board includes a conductive pattern connected between the feed path and the first ground path. The wireless communication circuit is configured to supply a signal, through the feed path, to the conductive portion and the conductive pattern. The signal is radiated through the conductive portion and the conductive pattern.