公开(公告)号：US12079146B2

公开(公告)日：2024-09-03

申请号：US17383056

申请日：2021-07-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jeonghyeon Cho ,  Yongsuk Kwon ,  Kyungsoo Kim ,  Jonghoon Kim ,  Jonghyun Seok ,  Jonggeon Lee

IPC: H05K1/02 ,  G06F1/20 ,  G06F1/30 ,  G06F13/12 ,  G06F13/16 ,  G06F13/364 ,  G06F13/40 ,  G11C5/04 ,  G11C5/06 ,  G11C7/10 ,  H05K1/14 ,  H05K1/16 ,  H05K1/18 ,  H05K3/36 ,  H05K7/02 ,  H05K7/20

CPC classification number: G06F13/1673 ,  G06F13/4068 ,  G06F13/409 ,  G11C5/06 ,  G11C7/1063

Abstract: A memory module includes a memory substrate including a main connector and an auxiliary connector, configured to be connected to an external device; and a plurality of memory chips mounted on at least one of a first surface or a second surface of the memory substrate, wherein the main connector is disposed on one side of the memory substrate, and the auxiliary connector is disposed on the second surface of the memory substrate.

公开(公告)号：US20250105517A1

公开(公告)日：2025-03-27

申请号：US18903650

申请日：2024-10-01

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sanghoon CHOI ,  Youngjung Kim ,  Jonghoon Kim ,  Dongjun Oh ,  Himchan Yun ,  Youngsung Lee ,  Aro Cheon

IPC: H01Q5/50 ,  H01Q1/50

Abstract: An electronic device includes: a conductive portion; a printed circuit board having a first ground path, a second ground path, and a feed path; and a wireless communication circuit on the printed circuit board. The conductive portion includes a feed point, a first ground point, and a second ground point. The first ground point is connected to a ground of the electronic device through the first ground path. The second ground point is connected to the ground through the second ground path. The feed point is electrically connected to the wireless communication circuit through the feed path. The printed circuit board includes a conductive pattern connected between the feed path and the first ground path. The wireless communication circuit is configured to supply a signal, through the feed path, to the conductive portion and the conductive pattern. The signal is radiated through the conductive portion and the conductive pattern.

公开(公告)号：US20240377740A1

公开(公告)日：2024-11-14

申请号：US18614294

申请日：2024-03-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jooyoung Song ,  Jonghoon Kim ,  Hye-Reun Kim ,  Mingi Choi

IPC: G03F7/039 ,  G03F7/004 ,  G03F7/09 ,  G03F7/16

Abstract: Provided are positive type photoresist compositions including a polymer resin, a crosslinking agent, and a photoacid generator, wherein the polymer resin includes a main chain including a linking group decomposable under acidic conditions and a thermally crosslinkable functional group linked to the main chain and the crosslinking agent includes a functional group capable of reacting with the thermally crosslinkable functional group. The photoresist compositions of the present disclosure can be coated multiple times to realize a high-thickness photoresist film.

公开(公告)号：US12232260B2

公开(公告)日：2025-02-18

申请号：US17939546

申请日：2022-09-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seungjin Lee ,  Jonghoon Kim ,  Kyoungsun Kim ,  Sungjoo Park ,  Jinseong Yun ,  Young-Ho Lee ,  Jeonghyeon Cho ,  Heejin Cho

IPC: H05K1/11 ,  H05K1/02 ,  H05K3/40

Abstract: An electronic device includes: a multilayered base substrate including a plurality of substrate bases stacked on each other; a first conductive via and a second conductive via penetrating the substrate bases and spaced from each other; a conductive line electrically connecting the first conductive via and the second conductive via to each other and disposed on at least one of the substrate bases of the plurality of substrate bases; and an open stub including a first end and a second end, wherein the first end is connected to a connector of the conductive line, and the second end is opened.