公开(公告)号：US20190051592A1

公开(公告)日：2019-02-14

申请号：US15880917

申请日：2018-01-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： BU-WON KIM ,  Dae-ho Lee ,  Hee-jin Lee

IPC: H01L23/498 ,  H01L25/18 ,  H01L21/48 ,  H01L23/538 ,  H01L25/065

Abstract: A semiconductor package includes a circuit pattern extending in a horizontal direction. The circuit pattern is conductive. A first insulation layer is disposed on the circuit pattern. A semiconductor chip is disposed on the first installation layer. The first insulation layer includes first protrusions which protrude from a bottom surface of the first insulation layer, penetrate through at least a portion of the circuit pattern, and have a mesh structure. A second protrusion protrudes from the bottom surface of the first insulation layer and penetrates at least a portion of the circuit pattern. The second protrusion is spaced apart from the semiconductor chip in the horizontal direction. The second protrusion has a width in the horizontal direction wider than that of each of the first protrusions.

公开(公告)号：US20250070088A1

公开(公告)日：2025-02-27

申请号：US18660677

申请日：2024-05-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： JINHEE HONG ,  BU-WON KIM

IPC: H01L25/065 ,  H01L23/00

Abstract: A semiconductor package includes: a substrate including a plurality of connection pads; a first semiconductor chip on the substrate and including a plurality of first data pads on an upper surface thereof; a second semiconductor chip on the first semiconductor chip and including a plurality of second data pads on an upper surface thereof; a third semiconductor chip on the second semiconductor chip and including a plurality of third data pads on an upper surface thereof; and a plurality of connection members for connecting some of the plurality of connection pads and some of the plurality of first data pads, connecting the plurality of connection pads and the plurality of second data pads, and connecting some of the plurality of second data pads and some of the plurality of third data pads.