公开(公告)号：US20250038134A1

公开(公告)日：2025-01-30

申请号：US18771142

申请日：2024-07-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Junbae KIM ,  Byounggug MIN ,  Yoochang SUNG

IPC: H01L23/58 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L23/552 ,  H01L25/065 ,  H10B80/00

Abstract: A semiconductor package includes: a package substrate including upper pads, lower pads, and a first wiring layer electrically connecting first upper pads of the upper pads to first lower pads of the lower pads, respectively; a semiconductor chip disposed on the package substrate and electrically connected to the first upper pads; an encapsulant covering the semiconductor chip and at least a portion of the package substrate; a first conductive layer covering at least a portion of each of the encapsulant and the package substrate, wherein the first conductive layer is configured to apply a first voltage; a dielectric layer stacked on the first conductive layer; and a second conductive layer stacked on the dielectric layer, wherein the second conductive layer is configured to apply a second voltage.