公开(公告)号：US20200033389A1

公开(公告)日：2020-01-30

申请号：US16272304

申请日：2019-02-11

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Junbae KIM ,  Yongho CHO

IPC分类号： G01R31/00 ,  G01R1/04 ,  G01R31/28 ,  G01R31/26

摘要： A semiconductor device test system may include a body providing an internal space, in which a test device is loaded, and a cover coupled to the body to cover the internal space. The cover may include a first cover including first openings two-dimensionally arranged and a second cover including second openings two-dimensionally arranged. An arrangement of the first openings may be different from an arrangement of the second openings.

公开(公告)号：US20240304564A1

公开(公告)日：2024-09-12

申请号：US18394974

申请日：2023-12-22

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Junbae KIM ,  Taehwan KIM ,  Heejung HWANG

IPC分类号： H01L23/552 ,  H01L25/00 ,  H01L25/18 ,  H10B80/00

CPC分类号： H01L23/552 ,  H01L25/18 ,  H01L25/50 ,  H10B80/00 ,  H01L23/3128 ,  H01L24/16 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73215 ,  H01L2224/73265

摘要： An electronic device includes a base substrate; a first package mounted on the base substrate, the first package including a first substrate and a first semiconductor chip mounted on the first substrate; a second package mounted on the first package, the second package including a second substrate, a second semiconductor chip mounted on the second substrate, a sealing material surrounding an upper surface of the second substrate and the second semiconductor chip, and a conformal conductive coating formed on at least an upper surface of the sealing material. A conductive fixing portion is secured to a ground pad exposed at an upper surface of the base substrate. A shielding can is secured to the base substrate by the conductive fixing portion and includes a side portion extending around the first and second packages. A metal paste is formed between the shielding can and the conformal conductive coating to contact the shielding can and the conformal conductive coating.

公开(公告)号：US20170125085A1

公开(公告)日：2017-05-04

申请号：US15334380

申请日：2016-10-26

申请人： Samsung Electronics Co., Ltd.

发明人： Se-Young KIM ,  Junbae KIM

IPC分类号： G11C11/4078 ,  H01L27/02 ,  H01L27/108 ,  H02H9/04

CPC分类号： G11C11/4078 ,  G11C5/14 ,  G11C11/4074 ,  H01L27/0266 ,  H01L27/0285 ,  H01L27/0288 ,  H01L27/10897 ,  H02H9/046

摘要： Disclosed is an integrated protecting circuit, which detects ESD and EOS pulses to prevent an over-voltage from being applied to a semiconductor device. The integrated protecting circuit includes a first detector configured to detect an occurrence of an electrical over-stress between a first node to which a first voltage is applied and a second node to which a second voltage is applied, a second detector configured to detect an occurrence of an electrostatic discharge between the first and second nodes, a determination circuit configured to receive separate outputs of the first and second detectors at the same time and to generate a control signal, and a clamping device configured to perform a turn on/off operation in response to the control signal such that a voltage between the first and second nodes is clamped into a constant voltage.