公开(公告)号：US20230411155A1

公开(公告)日：2023-12-21

申请号：US18210374

申请日：2023-06-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngho HWANG ,  Sanghyun Lim ,  Jaehong Lim ,  Seok Heo

IPC: H01L21/027 ,  H01L21/324 ,  H01L21/67

CPC classification number: H01L21/0274 ,  H01L21/3245 ,  H01L21/67103 ,  H01L21/67248

Abstract: A manufacturing method of a semiconductor element includes: providing a photoresist on a wafer; supplying a first gas, containing oxygen, at a first flow rate to a bake chamber such that oxygen solubility of the photoresist becomes saturated, and supplying a second gas, which is oxygen-free, at a second flow rate to the bake chamber; and performing a bake process on the wafer in the bake chamber.

公开(公告)号：US20240192604A1

公开(公告)日：2024-06-13

申请号：US18216028

申请日：2023-06-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jaehong LIM ,  Youngho HWANG ,  Byungjo KIM ,  Sangki NAM ,  Suyoung YOO ,  Sanghyun LIM ,  Youngkyun IM ,  Hyungkyu CHOI ,  Seok HEO

IPC: G03F7/40

CPC classification number: G03F7/40

Abstract: A post baking apparatus comprising a baking chamber configured to receive a substrate with an exposed photoresist film, a lower heater in the baking chamber under the substrate to heat the exposed photoresist film, an applier applying an electric field or a magnetic field to the exposed photoresist film along a vertical direction, which is substantially perpendicular to an upper surface of the exposed photoresist film, to control diffusions of an acid or a secondary electron, which are generated from the exposed photoresist film, along a horizontal direction, and a controller configured to control an operation of the applier.

公开(公告)号：US20180040496A1

公开(公告)日：2018-02-08

申请号：US15475622

申请日：2017-03-31

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chunghun LEE ,  Janghwan KIM ,  Kwanghyun CHO ,  Youngho HWANG

IPC: H01L21/683 ,  H05B3/22 ,  H01L21/67 ,  H05B1/02

CPC classification number: H01L21/6833 ,  H01L21/67103 ,  H01L21/67248 ,  H05B1/0233 ,  H05B3/22 ,  H05B2203/005 ,  H05B2203/035 ,  H05B2213/03

Abstract: An electrostatic chuck system includes a first heater, a second heater, a chiller, and a controller. The first heater includes a plurality of resistors connected to a plurality of row wiring lines and a plurality of column wiring lines in a matrix form. The second heater includes a heater electrode in a concentric shape or a spiral shape. The chiller chills the first heater or the second heater. The controller controls the first heater, the second heater, and the chiller. The controller switches the row wiring lines and the column wiring lines of the first heater in a time-division manner to provide a power pulse to heat the resistors and a detect pulse to monitor a real-time resistance value or a real-time temperature of each of resistors connected to selected row wiring lines.

公开(公告)号：US20250031281A1

公开(公告)日：2025-01-23

申请号：US18389721

申请日：2023-12-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sanghyun LIM ,  Youngho HWANG ,  Juno PARK ,  Kyoungwhan OH ,  Youngkyun IM ,  Jaehong LIM ,  Chulmin CHO ,  Seok HEO

IPC: H05B3/26 ,  G03F7/00

Abstract: A substrate supporting member and a substrate processing apparatus including the same are provided. The substrate supporting member includes a plate having at least one heating zone. A heating member is on a first surface of the plate and located in the at least one heating zone. The heating member extends along a circumferential direction of the plate and is configured to heat a substrate supported by the plate. A first electrode is on the first surface of the plate and is connected to an inner side surface of the heating member. A second electrode is on the first surface of the plate and is connected to an outer side surface of the heating member. The heating member has a stair-step configuration such that a thickness of the heating member increases from the second electrode toward the first electrode.

公开(公告)号：US20250021025A1

公开(公告)日：2025-01-16

申请号：US18659932

申请日：2024-05-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngho HWANG ,  Sanghyun LIM ,  Youngkyun IM ,  Jaehong LIM ,  Chulmin CHO ,  Seok HEO

IPC: G03F7/00 ,  G03F7/16 ,  G03F7/32

Abstract: A substrate processing method includes: performing a first post-exposure baking process on a photoresist layer that was previously exposed to for extreme ultraviolet (EUV) exposed to EUV; developing the photoresist layer using a first developing solution having a first temperature; performing a second post-exposure baking process on the photoresist layer; developing the photoresist layer using a second developing solution having a second temperature, higher than the first temperature; and forming a photoresist pattern by performing a hard baking process on the photoresist layer.

公开(公告)号：US20210028034A1

公开(公告)日：2021-01-28

申请号：US16751882

申请日：2020-01-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngho HWANG ,  Sungyong PARK ,  Eunseok SEO ,  Hyeongseok JO ,  Seok HEO

IPC: H01L21/67 ,  G05B19/418 ,  G05D23/19 ,  G05D16/20 ,  H05B1/02

Abstract: A wafer processing apparatus is provided. The apparatus includes: a heating plate through which vacuum ports are formed; a plurality of temperature sensors; a heating device configured to heat the heating plate; first and second power supplies; temperature controllers to generate first and second feedback temperature control signals for controlling power output power supplies based on measurement values generated by the temperature sensors; an electronic pressure regulator configured to provide vacuum pressure for fixing a wafer to the plurality of vacuum ports; and a wafer chucking controller configured to control the electronic pressure regulator, and generate a feedback pressure control signal for controlling the electronic pressure regulator based on the first and second feedback temperature control signals.