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公开(公告)号:US20250061560A1
公开(公告)日:2025-02-20
申请号:US18798487
申请日:2024-08-08
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Minsu Kang , Kwang-Eun Kim , HuiSoo Kim , Seum Seo , Jeongho Ahn , Sungeun Lee , Chaeyoung Lee , Choonshik Leem , Woojin Jung
Abstract: A parameter optimization method includes receiving a plurality of SEM images respectively corresponding to a plurality of positions on a semiconductor wafer in which a first pattern and a second pattern are disposed based on overlay settings, determining a primary optimization parameter set based on the plurality of SEM images, clustering the plurality of SEM images to a plurality of clusters based on image attributes, and determining a secondary optimization parameter set corresponding to each of the plurality of clusters based on SEM images included in each of the plurality of clusters from among the plurality of SEM images and the primary optimization parameters.