公开(公告)号：US20220330463A1

公开(公告)日：2022-10-13

申请号：US17436357

申请日：2021-08-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hojong KIM ,  Changhwan JIN ,  Jonghun CHOI ,  Byungchul LEE ,  Jaeyoung HUH ,  Hyunchul HONG ,  Jaeuk RYU

IPC: H05K9/00 ,  H05K1/02 ,  G01R19/10 ,  G01R15/04

Abstract: An electronic device including a substrate on which an electronic component is mounted according to various embodiments may include: a first electromagnetic interference (EMI) shield configured to shield the electronic component included in a first region of the substrate; and a second EMI shield supported by at least a part of the first EMI shield and configured to shield the electronic component included in a second region of the substrate.